C25D7/001

Laminating magnetic cores for on-chip magnetic devices

A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

MAGNET ELECTROPLATING

Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.

LAMINATING MAGNETIC CORES FOR ON-CHIP MAGNETIC DEVICES

A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

Method and Apparatus for Increasing Skin Depth and Reducing Eddy Currents in Magnetic Metal-Based Materials Having Porous Insulation Layers by Using Metallic Ink Plating Techniques
20250087417 · 2025-03-13 ·

The present invention presents a method for reducing Hysteresis core loss and Eddy current core loss for magnetic components or materials integrating a porous insulation layer and the resulting apparatus. A metallic layer is formed, and a porous insulation layer is deposited. The insulation deposition is followed by the formation of an ink coverage layer which seals the voids of the porous insulation layer so that they become gaps. The ink coverage layer may be built upon to form subsequent component layers. The result is a component with a gapped porous insulation layer where the voids increase the insulation the porous insulation layer provides. This increases the directional impedance of the magnetic material or core while retaining the thinness of the layers, both insulation and metallic, that the use of porous insulation layers allows.

MAGNETS INCLUDING AN ALUMINUM MANGANESE ALLOY COATING LAYER AND RELATED METHODS

Magnets including a coating and related methods are described herein. The coating may include an aluminum manganese alloy layer. The aluminum manganese alloy layer may be formed in an electroplating process.

ELECTROMAGNETIC DEVICE HAVING LAYERED MAGNETIC MATERIAL COMPONENTS AND METHODS FOR MAKING SAME

A micro fabricated electromagnetic device and method for fabricating its component structures, the device having a layered magnetic core of a potentially unlimited number of alternating insulating and magnetic layers depending upon application, physical property and performance characteristic requirements for the device. Methods for fabricating the high performing device permit cost effective, high production rates of the device and its component structures without any degradation in device performance resulting from component layering.

Laminating magnetic cores for on-chip magnetic devices

A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

THIN FILM TYPE COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
20170004917 · 2017-01-05 ·

A thin film type coil component including coil patterns in a cross section shape having an undercut in lower portions thereof is provided. The coil patterns may reduce parasitic capacitance between the coil patterns, thereby minimizing electrical loss. The volume of the coil patterns may be increased, thereby improving inductance and resistance characteristics.

MAGNETS COMPRISING A COATING INCLUDING AN ALUMINUM LAYER

Magnets including a coating and related methods are described herein. The coating may include an aluminum layer. The aluminum layer may be formed in an electroplating process.

Electrodeposited materials and related methods

Described are electrodeposition methods, and materials and structures prepared by electrodeposition methods, and devices prepared from the electrodeposited materials.