Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.

Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.

The surface-treated material (10) according to the present invention is a surface-treated material including an electroconductive substrate (1) and a surface treatment coating film (2) including at least one metal layer formed above the electroconductive substrate (1), wherein a lowermost metal layer (21), as a metal layer included in the at least one metal layer and formed above the electroconductive substrate (1), is made of nickel, nickel alloy, cobalt, cobalt alloy, copper, or copper alloy, the surface-treated material includes an intervening layer (3) between the electroconductive substrate (1) and the surface treatment coating film (2), the intervening layer (3) containing a metal component of the electroconductive substrate (1), a metal component of the surface treatment coating film (2), and an oxygen component, and the mean thickness of the intervening layer (3) is in the range of 1.00 nm or larger and 40 nm or smaller as measured in the vertical cross-section of the surface-treated material.

A fuel injector including a fuel injector housing, a valve seat formed at one end of the fuel injector housing, and a valve body disposed in the fuel injector housing and operable to open and close a spray hole in the valve seat. The valve seat includes a base portion and insert portion having spray holes that is secured to the base portion.

An exothermic reaction assembly includes a reaction chamber and a generator operative to generate an AC electrical signal and apply the signal to the reaction chamber by superimposing the AC signal over a DC signal. A gas manifold and controller is operative to connect a vacuum pump and one or more gas chambers to the reaction chamber and to control a pressure of the reaction chamber. The signal generator is operative to create a plasma in the reaction chamber by superimposing the AC electrical signal to the reaction chamber over the DC signal. The gas manifold and controller are operative to adjust the pressure within the reaction chamber to achieve a predetermined plasma frequency.

An exothermic reaction assembly includes a reaction chamber and a generator operative to generate an AC electrical signal and apply the signal to the reaction chamber by superimposing the AC signal over a DC signal. A gas manifold and controller is operative to connect a vacuum pump and one or more gas chambers to the reaction chamber and to control a pressure of the reaction chamber. The signal generator is operative to create a plasma in the reaction chamber by superimposing the AC electrical signal to the reaction chamber over the DC signal. The gas manifold and controller are operative to adjust the pressure within the reaction chamber to achieve a predetermined plasma frequency.

Example implementations include a method of manufacturing a biochemical sensor by forming a fluid region in a microfluidic layer, forming a reference electrode on a planar surface of an electrode layer, forming a biochemical sensor electrode on the planar surface, forming a selective membrane on the biochemical sensor electrode, forming an enzymatic material including a biochemical sensing material on the selective membrane, and bonding the electrode layer to the microfluidic layer. Example implementations also include a device with a reference electrode disposed on a planar surface of an electrode layer, a biochemical sensor electrode disposed on the planar surface, a selective membrane disposed on the biochemical sensor electrode and impermeable to at least one biochemical interferent, and an enzymatic layer disposed on the selective membrane and electrically responsive to a biochemical.

A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etching of a substrate composed of a metal or metal alloy using a dealloying process.

A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etching of a substrate composed of a metal or metal alloy using a dealloying process.

Provided are an electrolytic copper foil, and an electrode and a copper-clad laminate comprising the same. The electrolytic copper foil comprises a base copper layer having a drum side and a deposited side; wherein the electrolytic copper foil has a Charpy impact strength from 0.4 J/mm.sup.2 to 5.8 J/mm.sup.2.