A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10.sup.−6/K. A metal oxide layer is then disposed over a surface of the component body.

A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10.sup.−6/K. A metal oxide layer is then disposed over a surface of the component body.

Provided is a golf shaft, capable of ensuring peeling resistance of a colored layer to endure a bending process and the like. The golf shaft has a metal element tube, and a colored plating layer being a colored layer formed on a surface of the element tube, wherein the colored plating layer has a first strike plating layer on the element tube side, a satin-like plating layer layered on a surface of the first strike plating layer, a second strike plating layer layered on a surface of the stain-like plating layer, and a decorative plating layer layered on a surface of the second strike plating layer and colored according to a color of the colored plating layer.

Provided is a golf shaft, capable of ensuring peeling resistance of a colored layer to endure a bending process and the like. The golf shaft has a metal element tube, and a colored plating layer being a colored layer formed on a surface of the element tube, wherein the colored plating layer has a first strike plating layer on the element tube side, a satin-like plating layer layered on a surface of the first strike plating layer, a second strike plating layer layered on a surface of the stain-like plating layer, and a decorative plating layer layered on a surface of the second strike plating layer and colored according to a color of the colored plating layer.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A method of manufacturing blind rivets is revealed. First cutting a steel wire rod to get a rod with required length and forming a head portion at one end of the rod. Then performing threading on an outer surface of the rod to form outer threads and carrying out heat treatment including quenching and tempering at 380° C.±50° C. to get a threaded rod. Next cutting a steel wire rod according to a length required to get a tube and forming a through hole axially penetrating the tube and corresponding to the threaded rod. Then forming a mounting portion at an outer edge of one end of the tube, carrying out optical heat treatment at 1100° C.±100° C., and performing electroplating to get an outer tube. Lastly the threaded rod is inserted into the through hole of the outer tube and the assembly is completed.

A method of manufacturing blind rivets is revealed. First cutting a steel wire rod to get a rod with required length and forming a head portion at one end of the rod. Then performing threading on an outer surface of the rod to form outer threads and carrying out heat treatment including quenching and tempering at 380° C.±50° C. to get a threaded rod. Next cutting a steel wire rod according to a length required to get a tube and forming a through hole axially penetrating the tube and corresponding to the threaded rod. Then forming a mounting portion at an outer edge of one end of the tube, carrying out optical heat treatment at 1100° C.±100° C., and performing electroplating to get an outer tube. Lastly the threaded rod is inserted into the through hole of the outer tube and the assembly is completed.

A metal porous body having a three-dimensional network structure, includes: a framework forming the three-dimensional network structure; and a coating layer having fine pores and coating the framework, the three-dimensional network structure including a rib and a node connecting a plurality of ribs, the framework including an alkali-resistant first metal, the fine pores having an average fine pore diameter of 10 nm or more and 1 μm or less, the coating layer including an alkali-resistant second metal and optionally including an alkali-soluble metal, the alkali-soluble metal being contained at a proportion of 0% by mass or more and 30% by mass or less with reference to a total mass of the framework and the coating layer.

An anisotropic conductive sheet has an insulation layer having a plurality of through-holes and a plurality of conductive layers each arranged on an inner wall surface of each of the plurality of through-holes. Each of the conductive layers has a base layer arranged on the inner wall surface of each of the through-holes and a metal plating layer arranged so as to contact with metal nanoparticles or a metal thin film in the base layer or the metal thin film. The base layer includes metal nanoparticles or a metal thin film and a binder, wherein at least a portion of the binder is arranged between the inner wall of each of the through-holes and the metal nanoparticles or the metal thin film. The binder is a sulfur-containing compound having a thiol group, a sulfide group or a disulfide group.