Patent classifications
C25D7/06
THERMAL SPRAY WIRE
Provided is a thermal spray wire as a thermal spray material for use in continuous arc wire thermal spraying machines, the thermal spray wire being for performing continuous and stable arc thermal spraying with sufficient electrical conductivity and at a stable voltage. The thermal spray wire includes a copper-plated coating having a thickness of from 0.3 to 1.2 μm on a surface of a rod made of stainless steel. Using the thermal spray wire allows for stable arc thermal spraying by a continuous arc thermal spraying machine including a wire feeding mechanism.
Steel sheet having excellent image clarity after painting
Provided is a steel sheet having excellent image clarity after painting, including: carbon (C): 0.001% to 0.03%, silicon (Si): 0.001% to 0.35%, manganese (Mn): 0.05% to 2.2%, phosphorus (P): 0.003% to 0.1%, sulfur (S): 0.001% or 0.025%, aluminum (Al): 0.01% to 0.1%, nitrogen (N): 0.001% to 0.007%, and a remainder of iron (Fe) and inevitable impurities. The microstructure of the steel sheet mainly is ferrite phases. An R-cube texture of a surface layer of the steel sheet is 5% or less by area %.
Steel sheet having excellent image clarity after painting
Provided is a steel sheet having excellent image clarity after painting, including: carbon (C): 0.001% to 0.03%, silicon (Si): 0.001% to 0.35%, manganese (Mn): 0.05% to 2.2%, phosphorus (P): 0.003% to 0.1%, sulfur (S): 0.001% or 0.025%, aluminum (Al): 0.01% to 0.1%, nitrogen (N): 0.001% to 0.007%, and a remainder of iron (Fe) and inevitable impurities. The microstructure of the steel sheet mainly is ferrite phases. An R-cube texture of a surface layer of the steel sheet is 5% or less by area %.
Method for making cost-effective nickel-63 radiation source for true random number generators
A method for electro-depositing a radioactive material onto a metal substrate is disclosed. This is particularly well-suited for true random number generators. The method includes (a) at least partially masking the metal substrate to expose a metallic surface on the metal substrate; (b) connecting the metal substrate to a cathode of a current source; (c) submersing the exposed metallic surface into a solution containing radioactive metal ions, wherein the solution is connected to an anode of the current source; (d) removing the exposed metallic surface from the solution; (e) removing the solution from the exposed metallic surface; (f) measuring the amount of radioactivity emitted from the exposed metallic surface; and (g) repeating steps (c) through (f) until the amount of radioactivity measured in step (f) is stabilized relative to a previous measurement.
HIGH-STRENGTH COLD-ROLLED STEEL SHEET HAVING EXCELLENT PHOSPHATABILITY AND MANUFACTURING METHOD THEREFOR
The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50 mg/m.sup.2 or less.
According to the present invention, provided are a high-strength cold-rolled steel sheet and a manufacturing for manufacturing same. In the high-strength cold-rolled steel sheet, a metal layer is coated on a cold-rolled steel sheet to a thickness of nanometers, followed by annealing, thereby suppressing the formation of oxides of Si, Mn, and the like on the surface of the steel sheet to within a range in which the elution of Fe is not suppressed, and thus the high-strength cold-rolled steel sheet has improved phosphatability.
CONDUCTIVE FILM AND PREPARATION METHOD THEREFOR
Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.
Method for coating steel sheets or steel strips and method for producing press-hardened components therefrom
The invention relates to a method for coating a steel sheet or steel strip to which an aluminium-based coating is applied in a dip-coating process and the surface of the coating is freed of a naturally occurring aluminium oxide layer. In order to provide a low-cost method for coating steel sheets or steel strips that makes the steel sheets or steel strips outstandingly suitable for the production of components by means of press hardening and for the further processing thereof, it is proposed that transition metals or transition metal compounds are subsequently deposited on the freed surface of the coating to form a top layer. The invention also relates to a method for producing press-hardened components from the aforementioned steel sheets or steel strips with an aluminium-based coating.
Electrodeposited copper foil and copper clad laminate
An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T.sub.105.0 wt % and in a range of 550° C. to 750° C.
Liquid mixture for filling blind holes in copper foil
Provided is a liquid mixture for filling blind holes in copper foil, relating to the technical field of electroplating hole filling. The liquid mixture comprises copper sulfate pentahydrate 210-240 g/L, citric acid 40-50 g/L, tartaric acid 10-20 g/L, chloride ion 40-70 ppm, accelerator 0.5-2 g/L, leveling agent 5-15 g/L, inhibitor 5-10 g/L, and sulfonate ion liquid 50-180 g/L. The leveling agent comprises tetranitro blue tetrazolium blue and triazolyl acetyl hydrazide.
Liquid mixture for filling blind holes in copper foil
Provided is a liquid mixture for filling blind holes in copper foil, relating to the technical field of electroplating hole filling. The liquid mixture comprises copper sulfate pentahydrate 210-240 g/L, citric acid 40-50 g/L, tartaric acid 10-20 g/L, chloride ion 40-70 ppm, accelerator 0.5-2 g/L, leveling agent 5-15 g/L, inhibitor 5-10 g/L, and sulfonate ion liquid 50-180 g/L. The leveling agent comprises tetranitro blue tetrazolium blue and triazolyl acetyl hydrazide.