Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.

The invention relates to a method and system for preventing corrosion of at least one metallic structure in an electrolyte medium, comprising applying a superimposed time-varying frequency electromagnetic wave to the structure, the method comprising the steps of generating a superimposed time-varying frequency electromagnetic wave (DAC wave) where an AC driving signal with time-varying frequency is riding on a DC output with a predefined DC bias voltage, transmitting the DAC wave current to one or more emitters, emitting the DAC wave via the one or more emitters, placing the one or more emitters at a spaced distance from the metallic structure, subjecting the metallic structure to the DAC wave current, controlling the negative return current of the DAC wave from the metallic structure, such that the DAC wave is distributed across the structure surface and directly excites a target region of the metallic structure, and wherein the excitation induces a flow of ionic current having a DC component travelling in a pulsating and time-varying manner in the target region and effects induced vibration of electrons and molecules in the target region. The method and the system of the invention significantly reduce capital costs and require very low energy, they avoid environmentally unfriendly final products, and are able to result in effective corrosion protection of metallic structures in different surrounding conditions.

The present embodiment relates to an internal combustion engine having an anodic oxide coating formed on at least a portion of an aluminum-based wall surface facing a combustion chamber. The anodic oxide coating has a plurality of nanopores extending substantially in the thickness direction of the anodic oxide coating, a first micropore extending from the surface toward the inside of the anodic oxide coating, and a second micropore present in the inside of the anodic oxide coating; the surface opening diameter of the nanopores is 0 nm or larger and smaller than 30 nm; the inside diameter of the nanopores is larger than the surface opening diameter; the film thickness of the anodic oxide coating is 15 m or larger and 130 m or smaller; and the porosity of the anodic oxide coating is 23% or more.

A manufacturing method of a mold, the mold having at its surface a plurality of recessed portions whose two-dimensional size is not less than 10 nm and less than 500 nm when viewed in a direction normal to the surface, the method including: (a) providing a mold base, (b) partially anodizing an aluminum alloy layer, thereby forming a porous alumina layer which has a plurality of minute recessed portions; and (c) after step (b), bringing the porous alumina layer into contact with a first etching solution, thereby enlarging the plurality of minute recessed portions of the porous alumina layer. Step (a) of providing the mold base includes (a1) providing a metal base, (a2) forming an aluminum alloy layer on the metal base, and (a3) forming a surface protection layer on the aluminum alloy layer. Step (a2) and step (a3) are performed in a same chamber.

An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.

Structures, devices and methods are provided for forming nanowires on a substrate. A first protruding structure is formed on a substrate. The first protruding structure is placed in an electrolytic solution. Anodic oxidation is performed using the substrate as part of an anode electrode. One or more nanowires are formed in the protruding structure. The nanowires are surrounded by a first dielectric material formed during the anodic oxidation.

A multilayer component is disclosed. In an embodiment, a multilayer component includes a fully active stack comprising a plurality of dielectric layers, internal electrodes and two external electrodes arranged on opposite sides of the stack, wherein at least one portion of the internal electrode layers are coated.

The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.

An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.

The invention relates to a method and system for treating water within a water system to control one or more of scaling, corrosion, bacteria and algae. In particular, the invention relates to methods and systems for applying a superimposed time-varying frequency electromagnetic wave comprising both AC and DC components in a pulsating manner to water within a water system, such as, for example, cooling water systems, cooling towers, boiler systems and water storage systems. The method and the system of the invention significantly reduce capital costs and require very low energy, they avoid environmentally unfriendly final products, and are able to result in various treatment effects simultaneously.