Patent classifications
C25D11/02
Carbon paste and solid electrolytic capacitor element
A carbon paste including a carbon powder, a resin, and an oxygen releasing oxidizer. The amount of the oxidizer is 3 to 30 parts by mass based on 100 parts by mass of the total amount of the carbon powder and the resin. A solid electrolytic capacitor element is prepared by a method which includes making a valve-action metal powder sintered to obtain an anode body, electrolytically oxidizing a surface of the anode body to chemically convert the surface into a dielectric layer, electrolytic polymerization to form a semiconductor layer of an electro conductive polymer on the dielectric layer, applying the carbon paste onto the semiconductor layer, and drying and hardening the carbon paste to form a carbon layer.
METALLIC PICTURE PRINT WITH THE USE OF DIFFERENTIALLY OXIDIZED AND/OR NITRIDIZED LAYERS, AND METHOD FOR MAKING THE SAME
The present invention relates to a metal such as titanium and niobium with differentially oxidized and/or nitridized layers for a metallic picture print, and method for producing the same. More specifically, this invention relates to a metal surface modified by differential oxidation and/or nitridation for making durable metallic picture prints to limit degradation to a picture print caused by UV radiation and chemical reactions.
Hardened silver coated journal bearing surfaces and method
An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.
Hardened silver coated journal bearing surfaces and method
An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.
Partial surface treatment apparatus
A partial surface treatment apparatus includes a first electrode member electrically connected to a treatment object including an outer circumferential surface and a circumferential groove, a second electrode member including an inner circumferential surface, a pair of annular-shaped elastic sealing members configured to seal a clearance between the outer circumferential surface and the inner circumferential surface, an accommodation portion accommodating each of the annular-shaped elastic sealing members, the annular-shaped elastic sealing members are movable in a diameter reduction direction, a pressure applying mechanism supplying a pressurized fluid to the annular-shaped elastic sealing members, the annular-shaped elastic sealing members are in pressure contact with the outer circumferential surface in a case where the annular-shaped elastic sealing members are moved in the diameter reduction direction, and a cutout formed at each of the annular-shaped elastic sealing members to be extended from an outer circumferential side edge portion towards the inner circumferential side.
Methods for incorporating ultraviolet light absorbing compounds into anodic oxides
The embodiments described herein relate to anodic oxides and methods for forming anodic oxides. The methods involve incorporating an ultraviolet (UV) light absorbing compounds into anodic oxides to prevent color fading of the anodic oxides caused by exposure to UV light. In some embodiments, the UV light absorbing compound includes para-aminobenzoic acid (PABA). The UV light absorbing compound can be incorporated within the anodic oxide during a sealing process. The UV light absorbing compound becomes infused within a seal layer, which is formed during the sealing process. The resultant anodic oxide has a UV light absorbing seal layer that can block UV light from reaching any underlying colorant existing within the anodic oxide.
Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Components of an electronic device and methods for their assembly
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Nanostructured Material, Production Process and Use Thereof
The present document provides details of a nanostructured material defined by an anodized alumina having a nanostructure with transverse pores that pass through and connect longitudinal pores grown on an aluminum substrate. This document also describes the process for producing said nanostructured material and the possible use thereof as a template or mould for obtaining nanostructures formed by nanowires, which are generated in the cavities or pores of the aforementioned nanostructure of the nanomaterial of the invention. Likewise, this document details the use of the nanostructured anodized alumina material as a mould for producing nanostructures.
Interfacial diffusion barrier layer including iridium on a metallic substrate
An article may include a substrate, a diffusion barrier layer formed on the substrate, and a protective layer formed on the diffusion barrier coating. The diffusion barrier layer may include iridium.