Patent classifications
C25D17/005
DECORATIVE AUTOMOTIVE COMPONENT HAVING MULTIPLE ELECTRICAL CURRENT PATHWAYS AND DIFFERENT SURFACE FINISHES
A decorative work piece or component, such as a decorative automotive trim component, and method for plating a work piece is provided. An electroless layer of material is applied to the work piece using an electroless plating process. A barrier in electrical conductivity is provided on the work piece to divide the work piece into a first segment and a second segment which are substantially electrically insulated from one another, prior to electroplating the work piece. A plurality of methods are disclosed for dividing the work piece into the first and second segments. The component includes different surface finishes on each of the electrically isolated segments, with the finishes having different appearance, gloss level, color, and/or distinction of image as a result of electroplating and without post-electroplating mechanical alteration and assembly.
Electroplating Method for Enhancing the Performance of Rolled-Up Passive Components
An electroplating method for enhancing the performance of rolled-up passive components comprises providing an array of rolled-up passive components on a substrate, where each rolled-up passive component comprises a multilayer strip in a rolled configuration including multiple turns spaced apart by gaps. The multilayer strip comprises a conductive pattern layer on a strain-relieved layer, and a core of each rolled-up passive component is defined by a first of the multiple turns. A layer comprising a functional material is electroplated onto the conductive pattern layer of each rolled-up passive component, thereby at least partly filling the gaps and/or the core with the functional material.
Electrochemical plating system and method of using
An electrochemical plating (ECP) system is provided. The ECP system includes an ECP cell comprising a plating solution for an ECP process, a sensor configured to in situ measure an interface resistance between a plated metal and an electrolyte in the plating solution as the ECP process continues, a plating solution supply system in fluid communication with the ECP cell and configured to supply the plating solution to the ECP cell, and a control system operably coupled to the ECP cell, the sensor and the plating solution supply system. The control system is configured to compare the interface resistance with a threshold resistance and to adjust a composition of the plating solution in response to the interface resistance being below the threshold resistance.
SYSTEM AND PROCESS FOR PRODUCING LITHIUM
A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products.
Electrochemical three-dimensional printing and soldering
A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.
Film forming apparatus for forming metal film
Provided is a film forming apparatus for forming a metal film, capable of uniformly pressurizing a substrate surface with an electrolyte membrane subjected to the fluid pressure of an electrolytic solution containing metal ions during film formation even when an insoluble anode is used. A housing of the apparatus includes a partition member between the anode and the electrolyte membrane, for partitioning a housing chamber into first and second housing chambers. The partition member includes a porous body impregnated with cation exchange resin. The first housing chamber houses the anode insoluble in a first electrolytic solution. The second housing chamber has formed therein a hermetically sealed space in which a second electrolytic solution containing metal ions is enclosed within the housing, by the electrolyte membrane and the partition member. The apparatus is also provided with a pump (pressure unit) that pressurizes the second electrolytic solution in the second housing chamber.
Systems and methods for plate-up detection
Systems for electroplating seal inspection may include a module configured to support a seal for inspection. The module may include a set of supports positioned to contact an interior rim of the seal. The module may be configured to rotate the seal about a central axis. The system may also include a detector positioned on the module. The detector may be positioned to scan an exterior surface of the seal.
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE ELECTROPLATING SYSTEM
An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath. The plating cup includes a contact ring. The contact ring includes contacts. The contacts are immersed in the plating bath. The controller is configured to apply a voltage signal across the contact ring and the electrode to remove residual from the contacts. The voltage signal includes a plating-de-plating waveform. The plating-de-plating waveform includes multiple cycles. Each of the cycles includes a pair of pulses with different polarity.
METHOD FOR CREATING A CHROMIUM-PLATED SURFACE WITH A MATTE FINISH
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.
METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERATION SYSTEM
The disclosure discloses a method for manufacturing a solar cell, a solar module, and a power generation system. The manufacturing method includes the following steps: S1: perforating film layer in a first region and/or a second region of a solar cell where an electrode is to be disposed, thus forming a plurality holes; S2: growing a plurality seed layers on the solar cell, contacting with the first region and/or the second region through the plurality of holes or grooves in S1; and S3: horizontally transporting a to-be-electroplated solar cell on a horizontal electroplating device, to form a cathode on the seed layer, where an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from inlet to outlet, thus achieving electroplating.