Exemplary electroplating systems may include a vessel. The systems may include a paddle disposed within the vessel. The paddle may be characterized by a first surface and a second surface. The first surface of the paddle may be include a plurality of ribs that extend upward from the first surface. The plurality of ribs may be arranged in a generally parallel manner about the first surface. The paddle may define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures may have a diameter of less than about 5 mm. The paddle may have an open area of less than about 15%.

A high resistance virtual anode for an electroplating cell includes a first layer and a second layer. The first layer includes a plurality of first holes through the first layer. The second layer is over the first layer and includes a plurality of second holes through the second layer.

An electrochemical deposition system for depositing metal onto a workpiece, comprises a deposition chamber adapted to receive plating solution, a workpiece holder for holding a workpiece in a first plane, a shield holder for holding a shield in a second plane substantially parallel to the first plane, an agitation plate having a profiled surface to agitate plating solution, wherein the workpiece holder, shield holder and agitation plate are all adapted for insertion into and removal from the deposition chamber, and further comprising an actuator operable to change a relative distance between the workpiece holder and shield holder, in a direction normal to the first and second planes, while they are located within the deposition chamber.

A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.

An electrode for an apparatus (1) for electrolytically treating a workpiece (3), the apparatus (1) being of a type arranged to convey the workpiece (3) with a surface to be treated past and directed towards a surface of the electrode, is divided into segments (23a-e) at at least this surface of the electrode. The segments (23a-e) are arranged next to each other in a first direction (x). Adjacent segments (23a-e) are separated from each other along respective segment edges (24a-f) such as to allow adjacent segments (23a-e) to be maintained at different respective voltages. The segment edges (24a-f) extend at least partly in a second direction (y) from a common value (y.sub.0) of a co-ordinate in the second direction (y) to an edge (25,26) of at least an electrically conducting part of the electrode surface, the second direction (y) being transverse to the first direction (x) and corresponding to a direction of movement of the workpiece, in use. The segment edges (24a-f) between at least one pair of adjacent segments (23a-e) extend along respective paths of which an angle to the electrode surface edge (25,26) decreases from the common value (y.sub.0) of the co-ordinate to the electrode surface edge (25,26).

An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.

Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.

A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.

A plating device includes: an anode; a substrate holder which holds a substrate; a substrate contact which comes into contact with a peripheral edge portion of the substrate; a resistor which is disposed in a way of facing the substrate holder between the anode and the substrate holder, and is used for adjusting ion movement; and a rotation driving mechanism which causes the resistor and the substrate holder to relatively rotate. The resistor includes: a shielding region which forms an outer frame and shields the ion movement between the anode and the substrate; and a resistance region which is formed on the radially inner side of the shielding region, and has a porous structure allowing the passage of an ion. An outer diameter of the resistance region has an amplitude centering on an imaginary reference circle, and has a wave shape which is periodic and annularly continuous.

The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate and a data processing device. The distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate comprises a distribution body and a shield element. The distribution body comprises a plurality of openings for the process fluid. The shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid through the distribution body.