Systems and methods for automated electroplating are disclosed. An electroplating system includes a first chamber configured to receive one or more parts. The first chamber includes a vessel extending from a first end to a second end, a first cap proximate to the first end a first cathode contact coupled to the first end, a second cathode contact coupled to the second end, and a plurality of anodes formed on an inner surface of the vessel. The electroplating system further includes at least one reservoir and a first conduit and a second conduit each coupled between the at least one reservoir and the first chamber. The first conduit may be configured to transfer fluid from the first reservoir to the first chamber and the second conduit may be configured to transfer fluid from the first chamber to the at least one reservoir.

Methods are provided for modifying a porous surface of an implantable medical device by subjecting the porous surface to a modified micro-arc oxidation process to improve the ability of the medical device to resist microbial growth, to improve the ability of the medical device to adsorb a bioactive agent or a therapeutic agent, and to improve tissue in-growth and tissue on-growth of the implantable medical device.

Methods are provided for modifying a porous surface of an implantable medical device by subjecting the porous surface to a modified micro-arc oxidation process to improve the ability of the medical device to resist microbial growth, to improve the ability of the medical device to adsorb a bioactive agent or a therapeutic agent, and to improve tissue in-growth and tissue on-growth of the implantable medical device.

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode.

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode.

A method comprises depositing a barrier layer on a dielectric layer to prevent oxidation of a metal layer to be deposited by electroplating due to an oxide present in the dielectric layer and depositing a doped liner layer on the barrier layer to bond with the metal layer to be deposited on the liner layer by the electroplating. The dopant forms a protective passivation layer on a surface of the liner layer and dissolves during the electroplating so that the metal layer deposited on the liner layer by the electroplating bonds with the liner layer. The dopant reacts with the dielectric layer and forms a layer of a compound between the barrier layer and the dielectric layer. The compound layer prevents oxidation of the barrier layer and the liner layer due to the oxide present in the dielectric layer and adheres the barrier layer to the dielectric layer.

The present invention discloses a device and method for preventing bath crystallization of a squeezing component of electroplating equipment in the technical field of manufacturing of copper electroplating films. The device comprises a plating tank and a squeezing component located on the discharge end of the plating tank. A non-metallic film is squeezed by the squeezing component after being discharged from the plating tank. A wind cutting device is arranged between the plating tank and the squeezing component for wind cutting of the discharged non-metallic film; and a spraying component is arranged behind the squeezing component for spraying the squeezing component. The method comprises a step of adding a wind cutting device for wind cutting of a non-metallic film to remove bath and a step of adding a spraying component for spraying the squeezing component. In the present invention, the wind cutting device and the spraying component are added specifically to eliminate bath crystallization so as to avoid piercing or concave and convex points of non-metallic films caused by crystallization and fully improve the quality of the plating product.

The present invention discloses a device and method for preventing bath crystallization of a squeezing component of electroplating equipment in the technical field of manufacturing of copper electroplating films. The device comprises a plating tank and a squeezing component located on the discharge end of the plating tank. A non-metallic film is squeezed by the squeezing component after being discharged from the plating tank. A wind cutting device is arranged between the plating tank and the squeezing component for wind cutting of the discharged non-metallic film; and a spraying component is arranged behind the squeezing component for spraying the squeezing component. The method comprises a step of adding a wind cutting device for wind cutting of a non-metallic film to remove bath and a step of adding a spraying component for spraying the squeezing component. In the present invention, the wind cutting device and the spraying component are added specifically to eliminate bath crystallization so as to avoid piercing or concave and convex points of non-metallic films caused by crystallization and fully improve the quality of the plating product.

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.