Electroplating and painting systems, methods and power converters are disclosed to provide regulated individual DC output signals to anode structures distributed in a plating solution in a tank to promote formation of plating material on a workpiece using a PWM inverter to generate a first AC signal, a sinewave filter to provide a filtered AC signal, a multiphase isolation transformer to provide a plurality of isolated AC signals, a multi-pulse diode bridge rectifier to provide a DC rectifier output signal, an output filter to provide a filtered DC rectifier output signal, and a blocking diode to provide the filtered DC rectifier output signal to the corresponding tank anode structure.

Electroplating and painting systems, methods and power converters are disclosed to provide regulated individual DC output signals to anode structures distributed in a plating solution in a tank to promote formation of plating material on a workpiece using a PWM inverter to generate a first AC signal, a sinewave filter to provide a filtered AC signal, a multiphase isolation transformer to provide a plurality of isolated AC signals, a multi-pulse diode bridge rectifier to provide a DC rectifier output signal, an output filter to provide a filtered DC rectifier output signal, and a blocking diode to provide the filtered DC rectifier output signal to the corresponding tank anode structure.

An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution.

An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution.

A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.

A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.

To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.

To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.