There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

There are provided a plating apparatus and a plating method that allow determining an appropriate replacement timing of a diaphragm. The plating apparatus includes an anode bath, a cathode bath, a diaphragm, an analyzer, and a control device. The anode bath holds a plating solution and an insoluble anode. The cathode bath holds a plating solution containing an additive and a substrate. The diaphragm separates the plating solution held in the anode bath from the plating solution held in the cathode bath. The analyzer is configured to analyze a concentration of the additive in the plating solution in the cathode bath at every predetermined time interval. The control device is configured to calculate an actual consumption of the additive during the predetermined period based on the concentration of the additive analyzed at the every predetermined time interval. The control device includes a memory that stores an expected consumption of the additive during the predetermined period. The control device is configured to determine whether a difference between the actual consumption and the expected consumption is equal to or more than a predetermined value or not.

The purpose of the present invention is to provide a surface treatment device and a paddle with improved strength and uniform plating thickness by uniformly stirring surface treatment solution near an object to be plated. Also, the purpose of the present invention is to provide a surface treatment method capable of stirring for a long period of time, by uniformizing plating thickness, and by improving a strength of a paddle. A surface treatment device comprising at least one plateshaped paddle, in a surface treatment tank, for stirring surface treatment solution near an object to be plated by reciprocally moving the paddle with respect to the object to be plated, wherein the paddle is configured by integrally forming a plurality of square bars provided in depth direction of the surface treatment solution along the object to be plated at regular intervals, and a square bar of the plurality of square bars is provided with a curved surface with respect to the object to be plated in a cross section in thickness direction of the square bar.

The present disclosure relates to an anodizing apparatus that may include: a body; a jig tray disposed inside the body and having a plurality of coupling holes formed to pass therethrough in an upward and downward direction thereof; a plurality of jigs detachably coupled correspondingly to the plurality of coupling holes of the jig tray to fix a plurality of objects to be anodized thereto at a time; and an anodizing unit adapted to perform an anodizing process for the plurality of objects to be anodized and having a plurality of accommodation parts for storing electrolytes therein.

The present disclosure relates to an anodizing apparatus that may include: a body; a jig tray disposed inside the body and having a plurality of coupling holes formed to pass therethrough in an upward and downward direction thereof; a plurality of jigs detachably coupled correspondingly to the plurality of coupling holes of the jig tray to fix a plurality of objects to be anodized thereto at a time; and an anodizing unit adapted to perform an anodizing process for the plurality of objects to be anodized and having a plurality of accommodation parts for storing electrolytes therein.

An improved steel plate alkali electrolyzer uses an anode steel plate, by-polar steel plates, and a cathode steel plate (the number of bi-polar plated is determined by the voltage applied, the formula explained in Claim). The steel plate edges are wrapped with an insulating material to hold them in precise alignment. This unit is housed in a containment vessel, with the anode and cathode steel plates extending past the outside of the containment vessel to make electrical connections outside of liquid filled vessel. Shape and arrangement of the plates enables the gas production to create a circulating electrolyte (without the use of a pump) that produces a cooler operating and more efficient production of Brown's gas per watt, and less expensive to construction than any other known electrolyzer. Design is scalable allowing for a wide range of gas production and applications.

Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.

Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.