A concentration of a dissolved gas can be controlled by following an electroplating solution through a contactor, controlling a pressure within the contactor, and thereby maintaining the concentration of the dissolved gas in the electroplating solution within a first concentration range. The first concentration range is non-zero and sub-saturation.

Apparatus for galvanically growing a plurality of nanowires on a substrate, comprising a substrate holder and a housing, in which a chamber, a control unit and a storage tank for an electrolyte are arranged, the apparatus being designed to grow the plurality of nanowires from the electrolyte onto the substrate when the substrate holder with the substrate has been inserted into the chamber.

Apparatus for galvanically growing a plurality of nanowires on a substrate, comprising a substrate holder and a housing, in which a chamber, a control unit and a storage tank for an electrolyte are arranged, the apparatus being designed to grow the plurality of nanowires from the electrolyte onto the substrate when the substrate holder with the substrate has been inserted into the chamber.

A system for controlling an electrochemical production process includes a variable controllable power circuit and an electrolytic cell. The cell includes two electrodes and operates in different states dependent on the potential difference across the electrodes. The system includes a power circuit controller that causes the power circuit to apply a given potential difference across the electrodes to initiate operation of the cell in the one of multiple possible states associated with the given potential difference. The possible states include a production state associated with a first non-zero potential difference in which a product of interest is produced, and an idle state associated with a second non-zero potential difference in which the product of interest is not produced. A monitoring and control subsystem maintains a predefined set of production process conditions, including a predefined operating temperature range, while the cell operates in both the production state and the idle state.

Provided is a technique that allows ensuring an in-plane uniformity of film thickness of a substrate.

A plating apparatus 1 includes auxiliary anodes 60a, 606, 60c, 60d. End portion proximal regions in an extending direction of the auxiliary anode are covered by resistive elements 65 having electrical conduction rates larger than zero, and the electrical conduction rates are lower than an electrical conduction rate of a plating solution. A region closer to a center than the end portion proximal regions of the auxiliary anode is not covered by the resistive element, and a surface of the region closer to the center than the end portion proximal regions of the auxiliary anode is exposed.

Provided is a technique that allows ensuring an in-plane uniformity of film thickness of a substrate.

A plating apparatus 1 includes auxiliary anodes 60a, 606, 60c, 60d. End portion proximal regions in an extending direction of the auxiliary anode are covered by resistive elements 65 having electrical conduction rates larger than zero, and the electrical conduction rates are lower than an electrical conduction rate of a plating solution. A region closer to a center than the end portion proximal regions of the auxiliary anode is not covered by the resistive element, and a surface of the region closer to the center than the end portion proximal regions of the auxiliary anode is exposed.

There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.