The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode.

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode.

Proposed is a plating apparatus capable of detecting a film thickness of a plating film formed on a substrate during a plating process. The plating apparatus includes a plating tank, a substrate holder configured to hold a substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate and the anode to adjust an electric field, a first detection electrode disposed in a region between a surface to be plated of the substrate and the anode and having an electrode end disposed at a first position inside the resistor, a second detection electrode disposed at a second position where there is less change in potential as compared with the first position in the plating tank, and a controller that measures a potential difference between the first detection electrode and the second detection electrode, to estimate a thickness of a plating film on the substrate based on the potential difference.

Proposed is a plating apparatus capable of detecting a film thickness of a plating film formed on a substrate during a plating process. The plating apparatus includes a plating tank, a substrate holder configured to hold a substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate and the anode to adjust an electric field, a first detection electrode disposed in a region between a surface to be plated of the substrate and the anode and having an electrode end disposed at a first position inside the resistor, a second detection electrode disposed at a second position where there is less change in potential as compared with the first position in the plating tank, and a controller that measures a potential difference between the first detection electrode and the second detection electrode, to estimate a thickness of a plating film on the substrate based on the potential difference.

Disclosed is a manufacturing method for a tinplate, relating to the technical field of steel plate manufacturing. With regard to the manufacturing method for a tinplate: in the step of flattening a base plate, double stands are used for flattening, a first stand working roller have a surface roughness value Ra of 1.6-1.7 m and a rolling force of 5000-6000 kN, and a second stand working roller have a surface roughness value Ra of 0.5-0.6 m and a rolling force of 3000-4000 kN; in the step of electroplating the base plate, an electroplating solution have a Sn.sup.2+ concentration of 14-19 g/L; and in the step of passivating the base plate, a passivation solution have a temperature of 41-43 C., a pH value of 4.4-4.6, and a concentration of 16-18 g/L, the passivation electric charge density being 120-180 C/m.sup.2.

Disclosed is a manufacturing method for a tinplate, relating to the technical field of steel plate manufacturing. With regard to the manufacturing method for a tinplate: in the step of flattening a base plate, double stands are used for flattening, a first stand working roller have a surface roughness value Ra of 1.6-1.7 m and a rolling force of 5000-6000 kN, and a second stand working roller have a surface roughness value Ra of 0.5-0.6 m and a rolling force of 3000-4000 kN; in the step of electroplating the base plate, an electroplating solution have a Sn.sup.2+ concentration of 14-19 g/L; and in the step of passivating the base plate, a passivation solution have a temperature of 41-43 C., a pH value of 4.4-4.6, and a concentration of 16-18 g/L, the passivation electric charge density being 120-180 C/m.sup.2.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed-gas solvents. Unlike conventional electrolytes, the disclosed electrolytes are based on compressed-gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed-gas solvent includes a material that is in a gas phase and has a vapor pressure above atmospheric pressure at a room temperature. The disclosed compressed-gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high-pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, and pentafluoroethane. Also disclosed are battery structures and supercapacitor structures that use compressed gas solvent-based electrolytes, and techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed-gas electrolytes as an electroplating bath are also disclosed.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed-gas solvents. Unlike conventional electrolytes, the disclosed electrolytes are based on compressed-gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed-gas solvent includes a material that is in a gas phase and has a vapor pressure above atmospheric pressure at a room temperature. The disclosed compressed-gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high-pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, and pentafluoroethane. Also disclosed are battery structures and supercapacitor structures that use compressed gas solvent-based electrolytes, and techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed-gas electrolytes as an electroplating bath are also disclosed.

Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.