Disclosed are a method and apparatus for electroplating a solar cell precursor. The method includes providing a mask opening on a surface of a cell precursor to be electroplated, such that a conductive material layer of the cell precursor is exposed at a bottom of the mask opening. The method further includes directly or indirectly connecting a first end portion of a conductive piece to the conductive material layer of the cell precursor, such that an electrical connection is formed between the conductive piece and the cell precursor. The conductive piece is a flexible structure capable of being bent.

Disclosed are a method and apparatus for electroplating a solar cell precursor. The method includes providing a mask opening on a surface of a cell precursor to be electroplated, such that a conductive material layer of the cell precursor is exposed at a bottom of the mask opening. The method further includes directly or indirectly connecting a first end portion of a conductive piece to the conductive material layer of the cell precursor, such that an electrical connection is formed between the conductive piece and the cell precursor. The conductive piece is a flexible structure capable of being bent.

To improve uniformity of a plating film-thickness formed on a substrate. A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.

To improve uniformity of a plating film-thickness formed on a substrate. A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.

Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.

The present invention relates to an electroplating apparatus and an electroplating method, and more specifically, to an electroplating apparatus and an electroplating method, which can plate a target on one side of a substrate while moving an anode horizontally, and consistently maintain the concentration of iron ions in a plating solution through the injection of inert gas when the plating solution is supplied during the plating process, thereby providing excellent plating quality.

The present invention relates to an electroplating apparatus and an electroplating method, and more specifically, to an electroplating apparatus and an electroplating method, which can plate a target on one side of a substrate while moving an anode horizontally, and consistently maintain the concentration of iron ions in a plating solution through the injection of inert gas when the plating solution is supplied during the plating process, thereby providing excellent plating quality.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.