To improve in-plane uniformity of a film to be plated on a polygonal substrate. A plating apparatus includes: a plating tank; a substrate holder configured to hold a polygonal substrate; an anode disposed inside the plating tank such that the anode faces the substrate held by the substrate holder; and an anode mask defining an opening corresponding to an outer shape of the polygonal substrate. The anode mask includes a first mask member defining a first projecting portion projecting toward a center of the opening at a center portion of a first opening side of the opening corresponding to a first side of the polygonal substrate and a second mask member defining a second projecting portion projecting toward the center of the opening at a center portion of a second opening side of the opening corresponding to a second side of the polygonal substrate, and is configured to be able to adjust a mutual distance between the first mask member and the second mask member.

To improve in-plane uniformity of a film to be plated on a polygonal substrate. A plating apparatus includes: a plating tank; a substrate holder configured to hold a polygonal substrate; an anode disposed inside the plating tank such that the anode faces the substrate held by the substrate holder; and an anode mask defining an opening corresponding to an outer shape of the polygonal substrate. The anode mask includes a first mask member defining a first projecting portion projecting toward a center of the opening at a center portion of a first opening side of the opening corresponding to a first side of the polygonal substrate and a second mask member defining a second projecting portion projecting toward the center of the opening at a center portion of a second opening side of the opening corresponding to a second side of the polygonal substrate, and is configured to be able to adjust a mutual distance between the first mask member and the second mask member.

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P.sub.11 and continue with a period T.sub.11; step 3: when the period T.sub.11 ends, adjusting the first plating power supply applied on the first anode to output a power value P.sub.12 and continue with a period T.sub.12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P.sub.21 and continue with a period T.sub.21; and step 4: when the period T.sub.21 ends, adjusting the second plating power supply applied on the second anode to output a power value P.sub.22 and continue with a period T.sub.22; wherein step 2 to step 4 are performed periodically.

An electrochemical deposition system includes a tank, a primary anode, and a secondary anode, all positioned within the tank. When a substrate is placed in the tank, the primary anode is situated at a distance from the substrate. The secondary anode is located closer to the substrate, positioned between the primary anode and the substrate. The secondary anode has one or more electrically active elements designed to affect the deposition process.

An electrochemical deposition system includes a tank, a primary anode, and a secondary anode, all positioned within the tank. When a substrate is placed in the tank, the primary anode is situated at a distance from the substrate. The secondary anode is located closer to the substrate, positioned between the primary anode and the substrate. The secondary anode has one or more electrically active elements designed to affect the deposition process.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

An electroplating device includes a carrying module, a moving module, a driving module and ejecting tubes. The carrying module has a slide rail. The moving module has a first portion and a second portion. The first portion is movably disposed in the slide rail. The moving module is moved back and forth parallel to a length direction of the slide rail by the driving module. Opposite two ends of the ejecting tubes are respectively disposed on the first portion and the second portion. When the moving module is driven to move back and forth parallel to the length direction, the moving module drives the ejecting tubes to move back and forth as well. Each of the ejecting tubes has nozzles. The nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube.

An electroplating device includes a carrying module, a moving module, a driving module and ejecting tubes. The carrying module has a slide rail. The moving module has a first portion and a second portion. The first portion is movably disposed in the slide rail. The moving module is moved back and forth parallel to a length direction of the slide rail by the driving module. Opposite two ends of the ejecting tubes are respectively disposed on the first portion and the second portion. When the moving module is driven to move back and forth parallel to the length direction, the moving module drives the ejecting tubes to move back and forth as well. Each of the ejecting tubes has nozzles. The nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube.

A plating apparatus and a plating method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; a fixing device configured to fix the substrate at the opening of the side wall; at least one sealing element disposed around the opening; and a cleaning module coupled to the tank body for cleaning the at least one sealing element. A cleaning method is also provided for cleaning the at least one sealing element with the cleaning module after operation of the plating apparatus.