A plating device includes a plating cell that includes a plating tank and a housing surrounding the plating tank, wherein the plating tank is configured to contain a volume of electrolyte, and wherein a wafer can be immersed within the electrolyte. An electrolyte chamber is below the plating cell and is configured to accommodate discharged electrolyte from the plating cell. A connection part is in fluid communication with the plating cell and the electrolyte chamber so that the electrolyte discharged from the plating cell flows to the electrolyte chamber. A resupply part is configured to resupply the plating tank with electrolyte from the electrolyte chamber. The connection part includes a first pipe through which the electrolyte flows at a first flow rate and a second pipe downstream of the first pipe and through which the electrolyte flows at a second flow rate lower than the first flow rate.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.

A plating treatment technique with which influence of air bubbles or the like can be suppressed as much as possible in plating treatment on micro vias or trenches, and a plurality of plating treatments can be handled by one plating equipment. Plating equipment for vacuum plating treatment including: a plating tank including an opening portion having a seal that prevents leakage of a plating solution, and a solution supply section and a solution discharge section for the plating solution; a rotating unit for the plating tank; an in-tank decompression unit that reduces a pressure in an in-tank space; and an object-to-be-plated back surface press cover including a back surface decompression unit that presses a peripheral edge of an object to be plated placed at the opening portion to decompress in a back space formed on a back surface side of the object to be plated.

A plating treatment technique with which influence of air bubbles or the like can be suppressed as much as possible in plating treatment on micro vias or trenches, and a plurality of plating treatments can be handled by one plating equipment. Plating equipment for vacuum plating treatment including: a plating tank including an opening portion having a seal that prevents leakage of a plating solution, and a solution supply section and a solution discharge section for the plating solution; a rotating unit for the plating tank; an in-tank decompression unit that reduces a pressure in an in-tank space; and an object-to-be-plated back surface press cover including a back surface decompression unit that presses a peripheral edge of an object to be plated placed at the opening portion to decompress in a back space formed on a back surface side of the object to be plated.

Methods are provided for modifying a porous surface of an implantable medical device by subjecting the porous surface to a modified micro-arc oxidation process to improve the ability of the medical device to resist microbial growth, to improve the ability of the medical device to adsorb a bioactive agent or a therapeutic agent, and to improve tissue in-growth and tissue on-growth of the implantable medical device.

Methods are provided for modifying a porous surface of an implantable medical device by subjecting the porous surface to a modified micro-arc oxidation process to improve the ability of the medical device to resist microbial growth, to improve the ability of the medical device to adsorb a bioactive agent or a therapeutic agent, and to improve tissue in-growth and tissue on-growth of the implantable medical device.

Provided is a plating apparatus that allows cleaning a contact cleaning member. The plating apparatus includes: a plating tank configured to house a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward, the substrate holder including a contact member for feeding power to the substrate; a contact cleaning member 482 for discharging a cleaning liquid to the contact member while the contact cleaning member is at a cleaning position between the plating tank and the substrate holder; a driving mechanism 476 configured to move the contact cleaning member 482 between the cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover an upper portion of the contact cleaning member 482 while the contact cleaning member 482 is at the retracted position.

Provided is a plating apparatus that allows cleaning a contact cleaning member. The plating apparatus includes: a plating tank configured to house a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward, the substrate holder including a contact member for feeding power to the substrate; a contact cleaning member 482 for discharging a cleaning liquid to the contact member while the contact cleaning member is at a cleaning position between the plating tank and the substrate holder; a driving mechanism 476 configured to move the contact cleaning member 482 between the cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover an upper portion of the contact cleaning member 482 while the contact cleaning member 482 is at the retracted position.