A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A method for electrolytically depositing a chromium oxide layer onto i) blackplate or onto ii) blackplate coated with a chromium electrodeposited coating produced based on chromium(III) technology electroplating, and to the coated product obtained thereby.

A method for electrolytically depositing a chromium oxide layer onto i) blackplate or onto ii) blackplate coated with a chromium electrodeposited coating produced based on chromium(III) technology electroplating, and to the coated product obtained thereby.

In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamber is disposed within the plating cell, and a charge plate is disposed within the anode chamber. An anode is positioned above the charge plate within the anode chamber. In some examples, the anode chamber is a membrane-less anode chamber.

Disclosed are methods and systems of reversible metal electrodeposition (RME) devices with applications in dynamic smart windows. Embodiments use a RME device that includes two transparent substrates that sandwich a working electrode, counter electrode, and an electrolyte solution. Embodiments apply a pulsed voltage to the RME device that causes electrochemical deposition of metal ions from the electrolyte solution to create a metallic film on the working electrode. The metallic film results in reduced light transmittance of the RME device.

Disclosed are methods and systems of reversible metal electrodeposition (RME) devices with applications in dynamic smart windows. Embodiments use a RME device that includes two transparent substrates that sandwich a working electrode, counter electrode, and an electrolyte solution. Embodiments apply a pulsed voltage to the RME device that causes electrochemical deposition of metal ions from the electrolyte solution to create a metallic film on the working electrode. The metallic film results in reduced light transmittance of the RME device.

A finishing system includes a frame that includes a bath station configured to communicate with an electrode. A hoist supported by the frame is movable into register with the bath station to establish electrical communication between the hoist and a current generated by a power source. The current drives deposition of a coating onto a load carried by the hoist. A drive assembly of the system is supported by the hoist and is operable to rotate a sprocket. The drive assembly includes a rotary conductor electrically coupled to the sprocket and configured to come into electrical communication with the frame. An electrically conductive lifting chain is operable through rotation of the sprocket to lower the load into the bath station. The frame communicates current from the power source to the rotary conductor, and the lifting chain communicates current from the rotary conductor to the load.

A finishing system includes a frame that includes a bath station configured to communicate with an electrode. A hoist supported by the frame is movable into register with the bath station to establish electrical communication between the hoist and a current generated by a power source. The current drives deposition of a coating onto a load carried by the hoist. A drive assembly of the system is supported by the hoist and is operable to rotate a sprocket. The drive assembly includes a rotary conductor electrically coupled to the sprocket and configured to come into electrical communication with the frame. An electrically conductive lifting chain is operable through rotation of the sprocket to lower the load into the bath station. The frame communicates current from the power source to the rotary conductor, and the lifting chain communicates current from the rotary conductor to the load.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.