The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 μm or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing a heavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 μm or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing a heavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.

During the electrodeposition and electrorefining processes of metals, the electrodes undergo severe corrosion effects. A protective device and included system are proposed, wherein the electrode protective device solves the problem, given that its design and material preferably fireproof and anticorrosive, protect the electrodes. The design encompasses the entire exterior shape of the electrode support bar including the straight parts of the electrode plate that arise from the area of the support bars on both sides.

The present invention provides an in-situ method for synthesizing a Ni—W—WC composite coating, which includes the following steps: immersing a carbon steel substrate to be coated in an electroplating solution and electroplating, to obtain a Ni—W—C alloy coating on the surface of the carbon steel substrate; and then subjecting the alloy coating to high temperature heat treatment to obtain the Ni—W—WC composite coating. The electroplating solution comprises the following components: a nickel salt, a tungstate, citric acid, a citrate, a recarburizer, and a wetting agent. The present invention shows merits of simple operation, high current efficiency, simple electroplating process, and is clean and causes no pollution, thus meeting the requirements of environment protection.

The present invention provides an in-situ method for synthesizing a Ni—W—WC composite coating, which includes the following steps: immersing a carbon steel substrate to be coated in an electroplating solution and electroplating, to obtain a Ni—W—C alloy coating on the surface of the carbon steel substrate; and then subjecting the alloy coating to high temperature heat treatment to obtain the Ni—W—WC composite coating. The electroplating solution comprises the following components: a nickel salt, a tungstate, citric acid, a citrate, a recarburizer, and a wetting agent. The present invention shows merits of simple operation, high current efficiency, simple electroplating process, and is clean and causes no pollution, thus meeting the requirements of environment protection.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

An electrode for electrolytic processes, in particular to an anode suitable for oxygen evolution having a valve metal substrate, a catalytic layer, a protection layer consisting of oxides of valve metals interposed between the substrate and the catalytic layer and an outer coating of oxides of valve metals. The electrode is particularly suitable for processes of cathodic electrodeposition of chromium from an aqueous solution containing Cr (III).

An electrode for electrolytic processes, in particular to an anode suitable for oxygen evolution having a valve metal substrate, a catalytic layer, a protection layer consisting of oxides of valve metals interposed between the substrate and the catalytic layer and an outer coating of oxides of valve metals. The electrode is particularly suitable for processes of cathodic electrodeposition of chromium from an aqueous solution containing Cr (III).

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.