Methods for fabricating dendritic structures and tags include introducing an electrolyte material onto a substrate, into a substrate, or both onto and into a substrate, and applying an electrical potential to at least one pair of electrodes positioned on the substrate to form one or more dendritic structures on the substrate.

A plating apparatus (10) is disclosed including a plating tank (9), cathodes (1a to 1f), a holding mechanism (2), at least one anode (3), and a rotation mechanism (4). The plating tank (9) contains an annularly or helically wound substrate (90) together with a plating solution. The cathodes (1a to 1f) are placed inside the plating tank (9). The holding mechanism (2) holds the cathodes (1a to 1f) at positions electrically connected to the outer periphery of the substrate (90) and holds the substrate (90) via the cathodes (1a to 1f). The anode (3) is placed at least on the inner periphery side of the substrate (90) held by the holding mechanism (2). The rotation mechanism (4) rotates at least either the substrate (90) and cathodes (1a to 1f) held by the holding mechanism (2) or the anode (3), or both, around the axis of the wound substrate (90).

Provided is a film forming apparatus and a film forming method for forming a metal film capable of reducing the occurrence of discoloring or alteration of the metal film caused by drying of an electrolytic solution remaining on the surface of the formed metal film. A space where the metal film exists is sealed between a housing and a mount base in a state where the solid electrolyte membrane is in contact with the metal film. The film forming apparatus includes a water supply unit supplying a wash water to the sealed space such that the wash water flows onto the surface of the metal film being in contact with the solid electrolyte membrane, and a water discharge unit discharging a wash water from the sealed space such that the wash water having flown onto the surface of the metal film flows out from the surface of the metal film.

A film formation apparatus includes an anode, a solid electrolyte membrane between the anode and a substrate, a power supply that applies voltage between the anode and the substrate as a cathode, and a liquid reservoir that holds the anode and the solid electrolyte membrane while separating them apart from each other, the liquid reservoir storing electrolyte solution including metal ions between the anode and the solid electrolyte membrane. The solid electrolyte membrane includes a central portion that comes in contact with the substrate and the electrolyte solution, and an outer edge portion outside the central portion. The apparatus includes a membrane tensioning mechanism to apply a tensile force to the central portion toward the outer edge portion while storing the heated electrolyte solution in the liquid reservoir, to elongate the central portion.

A film formation apparatus includes an anode, a solid electrolyte membrane between the anode and a substrate, a power supply that applies voltage between the anode and the substrate as a cathode, and a liquid reservoir that holds the anode and the solid electrolyte membrane while separating them apart from each other, the liquid reservoir storing electrolyte solution including metal ions between the anode and the solid electrolyte membrane. The solid electrolyte membrane includes a central portion that comes in contact with the substrate and the electrolyte solution, and an outer edge portion outside the central portion. The apparatus includes a membrane tensioning mechanism to apply a tensile force to the central portion toward the outer edge portion while storing the heated electrolyte solution in the liquid reservoir, to elongate the central portion.

Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.

Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.

A method for manufacturing a wiring board is capable of forming a metal layer included in a wiring layer to have an even thickness. The method includes preparing a conductive first underlayer on a surface of a substrate; a conductive second underlayer on a surface of the first underlayer; and a seed layer on a surface of the second underlayer and containing metal. The method disposes a solid electrolyte membrane between an anode and the seed layer as a cathode; applies voltage between the anode and the first underlayer to form a metal layer on the surface of the seed layer; removes an exposed portion of the second underlayer without the seed layer from the substrate; and removes an exposed portion of the first underlayer without the seed layer from the substrate. The first underlayer is a material having a higher electrical conductivity than that of the second underlayer.

Disclosed is an electrolyte for the electrolytic deposition of chromium as a metal, comprising (a) a chromium (III) salt and (b) metallic chromium, the use of the electrolyte for producing chromium layers on rotationally symmetrical components, in particular gravure printing cylinders, and methods, in which this electrolyte is used.

Disclosed is an electrolyte for the electrolytic deposition of chromium as a metal, comprising (a) a chromium (III) salt and (b) metallic chromium, the use of the electrolyte for producing chromium layers on rotationally symmetrical components, in particular gravure printing cylinders, and methods, in which this electrolyte is used.