Disclosed herein are methods for electroplating which employ seed layer detection. Such methods may operate by selecting a wafer, illuminating one or more points within an interior region of the wafer surface, measuring a first set of one or more in-process color signals from the one or more points within the interior region, illuminating one or more points within an edge region of the wafer surface, measuring a second set of one or more in-process color signals from the one or more points within the edge region, each color signal having one or more color components, calculating a metric indicative of a difference between the color signals in the first and second sets of in-process color signals, determining whether an acceptable seed layer is present on the wafer based on whether the metric is within a predetermined range, and repeating the foregoing for one or more additional wafers.

Provided here is a method for providing a coating on a plurality of substrate particles utilizing concurrent dissolution and deposition processes occurring among a plurality of source particles. Both the plurality of source particles and the plurality of substrate particles are freely immersed in the aqueous solution to form a slurry. A pH of the aqueous solution the electrochemical potential between the plurality of source particles and the aqueous solution establishes the source particles at a corrosion potential providing the concurrent dissolution and re-deposition of a cationic species on the source particles. Agitation of the slurry generates close proximity and/or brief contact between source and substrate particles causing substrate particles pass through the local environment of the source particles, resulting in some portion of the cationic species depositing at nucleation sites on the substrate particles.

Provided here is a method for providing a coating on a plurality of substrate particles utilizing concurrent dissolution and deposition processes occurring among a plurality of source particles. Both the plurality of source particles and the plurality of substrate particles are freely immersed in the aqueous solution to form a slurry. A pH of the aqueous solution the electrochemical potential between the plurality of source particles and the aqueous solution establishes the source particles at a corrosion potential providing the concurrent dissolution and re-deposition of a cationic species on the source particles. Agitation of the slurry generates close proximity and/or brief contact between source and substrate particles causing substrate particles pass through the local environment of the source particles, resulting in some portion of the cationic species depositing at nucleation sites on the substrate particles.

A metal particle having a particle diameter of 10 m or more and 1000 m or less and includes Cu and trace elements and a total mass content of P and S, among other trace elements, is 3 ppm or more and 30 ppm or less. A method for producing a metal particle including producing a molten metal material by melting a metal material in a crucible, wherein Cu as determined in GDMS analysis is over 99.995% and a total of P and S is 3 ppm or more and 30 ppm or less; applying a pressure of 0.05 MPa or more and 1.0 MPa or less to drip the molten metal material through an orifice, thereby producing a molten metal droplet; and rapidly solidifying the molten metal droplet using an inert gas whose oxygen concentration is 1000 ppm or less.

A metal particle having a particle diameter of 10 m or more and 1000 m or less and includes Cu and trace elements and a total mass content of P and S, among other trace elements, is 3 ppm or more and 30 ppm or less. A method for producing a metal particle including producing a molten metal material by melting a metal material in a crucible, wherein Cu as determined in GDMS analysis is over 99.995% and a total of P and S is 3 ppm or more and 30 ppm or less; applying a pressure of 0.05 MPa or more and 1.0 MPa or less to drip the molten metal material through an orifice, thereby producing a molten metal droplet; and rapidly solidifying the molten metal droplet using an inert gas whose oxygen concentration is 1000 ppm or less.

A hydroxyl graphene-modified plating sealant and a preparation method thereof are disclosed. The plating sealant comprises a film-forming material, a resist, a defoaming agent, a levelling agent, and deionized water; the resist is a nanoscale hydroxyl graphene aqueous solution comprising hydroxyl graphene having a mass fraction of 3.5% to 4% and a pH of 8.0 to 9.5. Nanoscale hydroxyl graphene is used as a resist in the plating sealant of the disclosure, then the hydroxyl groups on hydroxyl graphene can react with the hydroxyl groups of the film-forming material, i.e. silica sol and the silane polymer, by dehydration condensation, thereby significantly improving the performance of the sealing film. The sealing film has higher corrosion resistance and abrasion resistance compared with that prepared by graphene or reduced graphene oxide sealant.

Provided are a metal electrodeposition cathode plate, the non-conductive film of which is not susceptible to failure and which can be used repeatedly, and a production method therefor. This cathode plate comprises a metal plate on which multiple disc-shaped protrusions are disposed, and a non-conductive film formed on the non-protrusion flat areas of the metal plate. The minimum film thickness Y of the non-conductive film at positions between the centers of adjacent protrusions is the same or greater than the height X of the protrusions. It is preferred that the height X of the protrusions is 50 m to 1000 m.

Disclosed herein are methods for electroplating which employ seed layer detection. Such methods may operate by selecting a wafer, illuminating one or more points within an interior region of the wafer surface, measuring a first set of one or more in-process color signals from the one or more points within the interior region, illuminating one or more points within an edge region of the wafer surface, measuring a second set of one or more in-process color signals from the one or more points within the edge region, each color signal having one or more color components, calculating a metric indicative of a difference between the color signals in the first and second sets of in-process color signals, determining whether an acceptable seed layer is present on the wafer based on whether the metric is within a predetermined range, and repeating the foregoing for one or more additional wafers.

Disclosed herein are methods for electroplating which employ seed layer detection. Such methods may operate by selecting a wafer, illuminating one or more points within an interior region of the wafer surface, measuring a first set of one or more in-process color signals from the one or more points within the interior region, illuminating one or more points within an edge region of the wafer surface, measuring a second set of one or more in-process color signals from the one or more points within the edge region, each color signal having one or more color components, calculating a metric indicative of a difference between the color signals in the first and second sets of in-process color signals, determining whether an acceptable seed layer is present on the wafer based on whether the metric is within a predetermined range, and repeating the foregoing for one or more additional wafers.

Magnets including a coating and related methods are described herein. The coating may include an aluminum layer. The aluminum layer may be formed in an electroplating process.