A dental instrument comprising a shaft and a working part adjoined thereto, with the working part having a coating in which abrasive bodies are embedded, is proposed. Firstly, the average proportion of the surface of the abrasive bodies which is covered by the coating can be at least 60%, preferably at least 65%, most preferably at least 70%. Secondly, the coating can, moreover, also consist of a nickel alloy which additionally contains at least one element selected from the group consisting of titanium, vanadium, niobium, chromium, molybdenum, tungsten, manganese, iron and cobalt. In addition, a process for coating a working part, in particular for producing a dental instrument of this type, and also the use of such a dental instrument for cutting machining of solid bodies are proposed.

Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration t.sub.f1 and having a first forward pulse peak current i.sub.f1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration t.sub.r1 and having a first reverse pulse peak current i.sub.r1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration t.sub.f2 and having a second forward pulse peak current i.sub.f2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration t.sub.r2, the second reverse pulse having a second reverse pulse peak current i.sub.r2.

An electrochemical method includes performing anodic halogenation of Cu foils, performing subsequent oxide-formation in a KHCO.sub.3 electrolyte, and performing an electroreduction in neutral KHCO.sub.3 to generate a copper catalyst.

An electrochemical method includes performing anodic halogenation of Cu foils, performing subsequent oxide-formation in a KHCO.sub.3 electrolyte, and performing an electroreduction in neutral KHCO.sub.3 to generate a copper catalyst.

A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.

A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.