Patent classifications
C30B1/02
FACILE ETCHING FOR SINGLE CRYSTAL CATHODE MATERIALS
A recycling and synthesis of charge material for secondary batteries generates single-crystal charge materials for producing batteries with greater charge cycle longevity. Charge material particles undergo a heating for fusing or enhancing grain boundaries between polycrystalline particles. The resulting, more well-defined grain boundaries are easily etched by a relatively weak mineral acid solution. The acid solution removes material at the grain boundaries to separate secondary particles into primary particles along the grain boundaries. The resulting single crystal (monocrystalline) charge material particles are washed and filtered, and typically re-sintered to accommodate any needed lithium (lithium carbonate), and result in a charge material with larger surface area, higher lithium diffusivity and lower cation ordering.
Methods for low energy inorganic material synthesis
The present invention relates to solvothermal vapor synthesis methods for the crystallization of a phase from a mixture of selected inorganic or organic precursors in an unsaturated vapor-phase reaction medium.
Methods for low energy inorganic material synthesis
The present invention relates to solvothermal vapor synthesis methods for the crystallization of a phase from a mixture of selected inorganic or organic precursors in an unsaturated vapor-phase reaction medium.
METHOD FOR CLONAL-GROWTH OF SINGLE-CRYSTAL METAL
A method for clonal-growth of a single-crystal metal, including: using copper as an example, placing an existing small-sized single-crystal copper foil with a plane of any index on a copper foil that needs to be single-crystallized, and performing annealing to obtain, by cloning, a large-area (in meters) single-crystal copper foil with the same surface index as that of the parent facet. The method solves the difficult problem of large-area single-crystal copper foil preparation. By performing annealing, a parent single-crystal copper foil with a very small size (˜0.25 cm.sup.2) can be cloned to produce a large-area (˜700 cm.sup.2) single-crystal copper foil, which is an increase in area of about 3000 times.
METHOD FOR CLONAL-GROWTH OF SINGLE-CRYSTAL METAL
A method for clonal-growth of a single-crystal metal, including: using copper as an example, placing an existing small-sized single-crystal copper foil with a plane of any index on a copper foil that needs to be single-crystallized, and performing annealing to obtain, by cloning, a large-area (in meters) single-crystal copper foil with the same surface index as that of the parent facet. The method solves the difficult problem of large-area single-crystal copper foil preparation. By performing annealing, a parent single-crystal copper foil with a very small size (˜0.25 cm.sup.2) can be cloned to produce a large-area (˜700 cm.sup.2) single-crystal copper foil, which is an increase in area of about 3000 times.
MONOLAYER GRAPHENE ON NON-POLAR FACE SiC SUBSTRATE AND CONTROL METHOD THEREOF
The present invention provides a control method to epitaxial growth monolayer graphene, in which a monolayer graphene is epitaxially grown on a non-polar crystal face at arbitrary angle of a non-polar crystal face SiC substrate, thereby utilizing the non-polar crystal face to manipulate the electrical transport properties of graphene. A monolayer graphene having ballistic transport properties can be epitaxially grown at arbitrary angle of non-polar crystal face SiC substrate by the above-mentioned control method.
MONOLAYER GRAPHENE ON NON-POLAR FACE SiC SUBSTRATE AND CONTROL METHOD THEREOF
The present invention provides a control method to epitaxial growth monolayer graphene, in which a monolayer graphene is epitaxially grown on a non-polar crystal face at arbitrary angle of a non-polar crystal face SiC substrate, thereby utilizing the non-polar crystal face to manipulate the electrical transport properties of graphene. A monolayer graphene having ballistic transport properties can be epitaxially grown at arbitrary angle of non-polar crystal face SiC substrate by the above-mentioned control method.
Infrared non-linear optical crystal, preparation process and application thereof
An infrared non-linear optical crystal has the following molecular formula: A.sub.18X.sub.21Y.sub.6M.sub.48, in which A is Ba, Sr or Pb; X is Zn, Cd or Mn; Y is Ga, In or Al; and M is S, Se or Te. The crystal belongs to trigonal system and has space group R3. The crystal Ba.sub.18Zn.sub.21Ga.sub.6S.sub.48 is a type I phase matching non-linear optical material, in a particle size range of 150˜210 μm, its powder frequency doubling intensity and the laser damage threshold are respectively 0.5 times and 28 times those of the commercial material AgGaS.sub.2. Other crystals have the same or similar structure and properties such as optical property. The infrared non-linear optical crystal of the present application has important prospects in military and civilian applications, and can be used in electro-optical countermeasures, resource detection, space antimissile and communications, etc.
Infrared non-linear optical crystal, preparation process and application thereof
An infrared non-linear optical crystal has the following molecular formula: A.sub.18X.sub.21Y.sub.6M.sub.48, in which A is Ba, Sr or Pb; X is Zn, Cd or Mn; Y is Ga, In or Al; and M is S, Se or Te. The crystal belongs to trigonal system and has space group R3. The crystal Ba.sub.18Zn.sub.21Ga.sub.6S.sub.48 is a type I phase matching non-linear optical material, in a particle size range of 150˜210 μm, its powder frequency doubling intensity and the laser damage threshold are respectively 0.5 times and 28 times those of the commercial material AgGaS.sub.2. Other crystals have the same or similar structure and properties such as optical property. The infrared non-linear optical crystal of the present application has important prospects in military and civilian applications, and can be used in electro-optical countermeasures, resource detection, space antimissile and communications, etc.
FERROELECTRIC THIN FILM AND FORMING METHOD THEREOF
A ferroelectric thin film and a forming method thereof are provided. The method of forming a ferroelectric thin film according to embodiments of the present invention comprises forming a sacrificial seed layer on a first substrate, forming a ferroelectric thin film on the sacrificial seed layer, and transferring the ferroelectric thin film to a second substrate. The ferroelectric thin film according to embodiments of the present invention is formed by the method.