The present disclosure relates to a process for fabricating a crystalline scintillator material with a structure of elpasolite type of theoretical composition A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) wherein: A is chosen from among Cs, Rb, K, Na, B is chosen from among Li, K, Na, C is chosen from among the rare earths, Al, Ga, M is chosen from among the alkaline earths, X is chosen from among F, Cl, Br, I,
y representing the atomic fraction of substitution of C by M and being in the range extending from 0 to 0.05, comprising its crystallization by cooling from a melt bath comprising r moles of A and s moles of B, the melt bath in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. Moreover, the crystals obtained can have compositions closer to stoichiometry and have improved scintillation properties.

Disclosed is a method for preparing polycrystalline silicon ingot. The preparation method comprises: randomly laying seed crystals with unlimited crystal orientation at the bottom of crucible to form a layer of seed crystals and obtaining disordered crystalline orientations; providing molten silicon above the layer of seed crystals, controlling the temperature at the bottom of the crucible, making the layer of seed crystals not completely melted; controlling the temperature inside the crucible, making the molten silicon growing above the seed crystals, the molten silicon inheriting the structure of the seed crystals, then obtaining polycrystalline silicon ingot. By adopting the preparation method, a desirable initial nucleus can be obtained for a polycrystalline silicon ingot, so as to reduce dislocation multiplication during the growth of the polycrystalline silicon ingot.

A method for depositing silicon feedstock material may include introducing a first gas including silicon into a reactor chamber and introducing a second gas including at least one of gallium or indium into the reactor chamber and depositing silicon doped with at least one of gallium or indium onto a surface within the reactor chamber. Doped silicon feedstock material may be obtained by the method may be used for obtaining a silicon wafer, a solar cell, and/or a PV module.

A method for depositing silicon feedstock material may include introducing a first gas including silicon into a reactor chamber and introducing a second gas including at least one of gallium or indium into the reactor chamber and depositing silicon doped with at least one of gallium or indium onto a surface within the reactor chamber. Doped silicon feedstock material may be obtained by the method may be used for obtaining a silicon wafer, a solar cell, and/or a PV module.

Disclosed is a method for preparing polycrystalline silicon ingot. The preparation method comprises: coating inner wall of the crucible with a layer of silicon nitride, followed by laying a layer of crushed silicon and feeding silicon in the crucible; the crushed silicon is laid in random order, and the layer of crushed silicon forms a supporting structure having numerous holes; melting the silicon to form molten silicon by heating, when solid-liquid interface reach the surface of the layer of crushed silicon or when the layer of crushed silicon melt partially, regulating thermal field to achieve supercooled state to grow crystals; after the crystallization of molten silicon is completely finished, performing annealing and cooling to obtain polycrystalline silicon ingot. By adopting the preparation method, a desirable initial nucleus can be obtained for a polycrystalline silicon ingot, so as to reduce dislocation multiplication during the growth of the polycrystalline silicon ingot.

Disclosed is a method for preparing polycrystalline silicon ingot. The preparation method comprises: coating inner wall of the crucible with a layer of silicon nitride, followed by laying a layer of crushed silicon and feeding silicon in the crucible; the crushed silicon is laid in random order, and the layer of crushed silicon forms a supporting structure having numerous holes; melting the silicon to form molten silicon by heating, when solid-liquid interface reach the surface of the layer of crushed silicon or when the layer of crushed silicon melt partially, regulating thermal field to achieve supercooled state to grow crystals; after the crystallization of molten silicon is completely finished, performing annealing and cooling to obtain polycrystalline silicon ingot. By adopting the preparation method, a desirable initial nucleus can be obtained for a polycrystalline silicon ingot, so as to reduce dislocation multiplication during the growth of the polycrystalline silicon ingot.

Example systems are described for producing solar grade silicon from a silicon-generating reaction and recycled silicon particles. In one example, a system for manufacturing high purity solid silicon includes a reactor and a cooling chamber. The reactor includes one or more outlets and a reactor chamber. The one or more outlets are configured to receive a silicon tetrahalide, a reducing agent, and recycled silicon particles. The reactor chamber is configured to react the silicon tetrahalide and the reducing agent to produce fresh silicon, a halide salt, and reaction heat. The reactor chamber heats the recycled silicon particles, the fresh silicon, and the halide salt using at least a portion of the reaction heat to form molten silicon and molten halide salt. The molten silicon includes melted fresh silicon and melted recycled silicon particles. The cooling chamber is configured to cool the molten silicon to form the solid silicon.

Example systems are described for producing solar grade silicon from a silicon-generating reaction and recycled silicon particles. In one example, a system for manufacturing high purity solid silicon includes a reactor and a cooling chamber. The reactor includes one or more outlets and a reactor chamber. The one or more outlets are configured to receive a silicon tetrahalide, a reducing agent, and recycled silicon particles. The reactor chamber is configured to react the silicon tetrahalide and the reducing agent to produce fresh silicon, a halide salt, and reaction heat. The reactor chamber heats the recycled silicon particles, the fresh silicon, and the halide salt using at least a portion of the reaction heat to form molten silicon and molten halide salt. The molten silicon includes melted fresh silicon and melted recycled silicon particles. The cooling chamber is configured to cool the molten silicon to form the solid silicon.

The present disclosure relates to a process for fabricating a crystalline scintillator material with a structure of elpasolite type of theoretical composition A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) wherein: A is chosen from among Cs, Rb, K, Na, B is chosen from among Li, K, Na, C is chosen from among the rare earths, Al, Ga, M is chosen from among the alkaline earths, X is chosen from among F, Cl, Br, I, y representing the atomic fraction of substitution of C by M and being in the range extending from 0 to 0.05, comprising its crystallization by cooling from a melt bath comprising r moles of A and s moles of B, the melt bath in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. Moreover, the crystals obtained can have compositions closer to stoichiometry and have improved scintillation properties.

The present disclosure relates to a process for fabricating a crystalline scintillator material with a structure of elpasolite type of theoretical composition A.sub.2BC.sub.(1-y)M.sub.yX.sub.(6-y) wherein: A is chosen from among Cs, Rb, K, Na, B is chosen from among Li, K, Na, C is chosen from among the rare earths, Al, Ga, M is chosen from among the alkaline earths, X is chosen from among F, Cl, Br, I, y representing the atomic fraction of substitution of C by M and being in the range extending from 0 to 0.05, comprising its crystallization by cooling from a melt bath comprising r moles of A and s moles of B, the melt bath in contact with the material containing A and B in such a way that 2s/r is above 1. The process shows an improved fabrication yield. Moreover, the crystals obtained can have compositions closer to stoichiometry and have improved scintillation properties.