Patent classifications
C01B21/068
CHLORODISILAZANES
Disclosed herein are chlorodisazanes; silicon-heteroatom compounds synthesized therefrom; devices containing the silicon-heteroatom compounds; methods of making the chlorodisilazanes, the silicon-heteroatom compounds, and the devices; and uses of the chlorodisilazanes, silicon-heteroatom compounds, and devices.
CHLORODISILAZANES
Disclosed herein are chlorodisazanes; silicon-heteroatom compounds synthesized therefrom; devices containing the silicon-heteroatom compounds; methods of making the chlorodisilazanes, the silicon-heteroatom compounds, and the devices; and uses of the chlorodisilazanes, silicon-heteroatom compounds, and devices.
METHOD AND SYSTEM FOR LOW TEMPERATURE ALD
A method and chemical delivery system are provided for low temperature atomic layer deposition. Thus, methods of forming nitrogen-containing thin films by atomic layer deposition using a substantially water free hydrazine gas and plasma treatment are provided.
METHOD AND SYSTEM FOR LOW TEMPERATURE ALD
A method and chemical delivery system are provided for low temperature atomic layer deposition. Thus, methods of forming nitrogen-containing thin films by atomic layer deposition using a substantially water free hydrazine gas and plasma treatment are provided.
METHOD FOR PREPARING SILICON NITRIDE POWDER FOR MANUFACTURING SUBSTRATE AND SILICON NITRIDE POWDER PREPARED THEREBY
Provided is a method for preparing silicon nitride powder for manufacturing a substrate. The method for preparing silicon nitride powder for manufacturing a substrate, according to an embodiment of the present invention, comprises the steps of: preparing mixed raw material powder comprising metallic silicon powder and crystalline phase control powder; preparing the mixed raw material powder into granules having a predetermined particle size; nitrifying the granules at a predetermined temperature ranging from 1,200-1,500? C. while nitrogen gas is applied to the granules at a predetermined pressure; and pulverizing the nitrified granules. According to the method, it is easy to realize powder having an ? crystal phase at a desired level, and when this is realized as a substrate, a substrate having compact density can be manufactured.
Carbothermal reduction reactor system, components thereof, and methods of using same
Methods, systems, and components suitable for carbothermal reduction processes are disclosed. Exemplary systems include a reactor, such as hybrid solarthermal-electric reactor, a solar thermal reactor, an electric reactor, or a reactor heated by gas combustion, a pellet source, a gas reactant source, and a vacuum source. The reactor can operate as a moving bed or pseudo moving bed reactor.
Silicon nitride powder, silicon nitride sintered body and circuit substrate, and production method for said silicon nitride powder
A silicon nitride powder having a specific surface area of 4.0 to 9.0 m.sup.2/g, a phase proportion of less than 40 mass %, and an oxygen content of 0.20 to 0.95 mass %, wherein a frequency distribution curve obtained by measuring a volume-based particle size distribution by a laser diffraction scattering method has two peaks, peak tops of the peaks are present respectively at 0.4 to 0.7 m and 1.5 to 3.0 m, a ratio of frequencies of the peak tops ((frequency of the peak top in a particle diameter range of 0.4 to 0.7 m)/(frequency of the peak top in a particle diameter range of 1.5 to 3.0 m)) is 0.5 to 1.5, and a ratio D50/D.sub.BET (m/m) of a median diameter D50 (m) determined by the measurement of particle size distribution to a specific surface area-equivalent diameter D.sub.BET (m) calculated from the specific surface area is 3.5 or more.
Silicon nitride powder, silicon nitride sintered body and circuit substrate, and production method for said silicon nitride powder
A silicon nitride powder having a specific surface area of 4.0 to 9.0 m.sup.2/g, a phase proportion of less than 40 mass %, and an oxygen content of 0.20 to 0.95 mass %, wherein a frequency distribution curve obtained by measuring a volume-based particle size distribution by a laser diffraction scattering method has two peaks, peak tops of the peaks are present respectively at 0.4 to 0.7 m and 1.5 to 3.0 m, a ratio of frequencies of the peak tops ((frequency of the peak top in a particle diameter range of 0.4 to 0.7 m)/(frequency of the peak top in a particle diameter range of 1.5 to 3.0 m)) is 0.5 to 1.5, and a ratio D50/D.sub.BET (m/m) of a median diameter D50 (m) determined by the measurement of particle size distribution to a specific surface area-equivalent diameter D.sub.BET (m) calculated from the specific surface area is 3.5 or more.
Method for producing ceramic sintered body, ceramic sintered body, and light emitting device
Provided are a method for producing a ceramic sintered body having improved light emission intensity, a ceramic sintered body, and a light emitting device. The method for producing a ceramic sintered body comprises preparing a molded body that contains a nitride fluorescent material having a composition containing: at least one alkaline earth metal element M.sup.1 selected from the group consisting of Ba, Sr, Ca, and Mg; at least one metal element M.sup.2 selected from the group consisting of Eu, Ce, Tb, and Mn; Si; and N, wherein a total molar ratio of the alkaline earth metal element M.sup.1 and the metal element M.sup.2 in 1 mol of the composition is 2, a molar ratio of the metal element M.sup.2 is a product of 2 and a parameter y and wherein y is in a range of 0.001 or more and less than 0.5, a molar ratio of Si is 5, and a molar ratio of N is 8, and wherein the nitride fluorescent material has a crystallite size, as calculated by X-ray diffraction measurement using the Halder-Wagner method, of 550 ? or less, and calcining the molded body at a temperature in a range of 1,600? C. or more and 2,200? C. or less to obtain a sintered body.
METHOD OF QUASI-ATOMIC LAYER ETCHING OF SILICON NITRIDE
A method of etching is described. The method includes providing a substrate having a first material containing silicon nitride and a second material that is different from the first material, forming a first chemical mixture by plasma-excitation of a first process gas containing H and optionally a noble gas, and exposing the first material on the substrate to the first chemical mixture. Thereafter, the method includes forming a second chemical mixture by plasma-excitation of a second process gas containing N, F, O, and optionally a noble element, and exposing the first material on the substrate to the second plasma-excited process gas to selectively etch the first material relative to the second material.