At the time of performing manufacture-related processing on a glass film (G1) with a manufacture-related-processing unit (9) while conveying the glass film (G1) with a belt conveyor (22d), the belt conveyor (22d) is configured to be capable of attracting the glass film (G1) to the belt (23d) on an upstream side in a conveyance direction of the glass film (G1) with respect to the manufacture-related-processing unit (9), and the belt conveyor (22d) is configured to be capable of changing attraction forces (P11 and P12) with respect to the glass film (G1) in a conveyance direction (X) of the glass film (G1).

A component of glass or glass ceramic having predamages arranged along at least one predetermined dividing line is provided. The dividing line has a row of predamages lying one behind the other. The predamages pass continuously through the glass or the glass ceramic with at least 90% of the predamages being cylindrically symmetrical. The glass or the glass ceramic has a material compaction of at least 1% relative to an actual material density in a radius of 3 μm about a longitudinal axis of respective pre-damaged points. The relative weight loss per pre-damaged point is less than 10% and the component has a thickness of at least 3.5 mm.

A pane-shaped glass element having two opposing side surfaces which are edge-wise interconnected by a number of edge surfaces, wherein in the or each edge surface there are provided filamentary damages forming side-by-side elongate depressions, and wherein the or each edge surface lies obliquely to the side surfaces, is to be further formed for particularly good usability in a plurality of possible applications. For this purpose, according to the invention, the respective edge surface has a surface roughness with a mean roughness value of at least 0.3 μm, and preferably of at most 2 μm, in a particularly advantageous embodiment of about 1 μm, in its region provided with the filamentary damages.

The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.

A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

This method includes a laser irradiation step of radiating, in at least a part of a preset cleaving line (CL) of a mother glass sheet (MG), laser light (L) to a position (OSP) separated from the preset cleaving line (CL) so that a crack (CR2) propagates along the preset cleaving line (CL).

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

A cutting method of a mother substrate includes: irradiating a laser to the mother substrate at first intervals along a first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate; and irradiating the laser to the mother substrate at second intervals different from the first intervals along the first cutting line overlapping edge areas positioned adjacent to corner portions of each of the display panel areas.