An electrochromic structure can include a substrate and an electrochromic residue disposed on the substrate. The electrochromic structure can include an electrochromic stack on the substrate. A process can be used to separate the structure. The process can include forming a filament in the substrate and applying a thermal treatment to the substrate. Forming a filament can be performed by applying a pulse of laser energy to the substrate. In a particular embodiment, a filament pattern including a plurality of filaments can be formed in the substrate. The substrate can include mineral glass, sapphire, aluminum oxynitride, spinel, or a transparent polymer.

A method for ablating a coating film, cutting glass, and performing post-treatment by using a laser according to the present invention includes coating one side or both sides of thin mother glass with a coating solution for preventing chemical contact in order to proceed with selective chemical treatment, drying the coating solution to form a coating film on one side or both sides of the thin mother glass, obtaining thin-film glasses in cell units applied to electrical and electronic products from the thin mother glass, healing a laser-cut surface of the cut thin-film glasses in cell units through selective chemical treatment of the cut thin-film glasses in cell units, cleaning the thin-film glasses in cell units, and then ablating all of a coating film formed on a surface of the thin-film glasses in cell units, and cleaning the thin-film glasses in cell units from which all of the coating film has been ablated and then chemically healing the surface of the thin-film glasses in cell units in order to eliminate defects or flaws on the surface of the thin-film glasses in cell units from which all of the coating film has been ablated.

A plate-like glass element including a pair of opposite side faces and at least one channel introduced into the glass of the glass element. The at least one channel joins the side faces and opens into the side faces. The at least one channel has a rounded wall and a transverse dimension of less than 100 ?m. The at least one channel extends in a longitudinal direction that runs transverse to the side faces. The rounded wall of the at least one channel has a plurality of rounded, substantially hemispherical depressions.

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

An apparatus for cutting laminated glass and film-covered glass includes a powered hand-held tool with a blade set including two static cutting blades and one dynamic, reciprocating cutting blade. The reciprocating cutting blade moves between the two static cutting blades which are rigidly mounted to the tool head. The left and right static cutting blades were spaced apart by about 0.250 inches, and the cutting blade had a thickness of about 0.200-0.250 inches. The clearance between the reciprocating and each static blade is between about 0.005-0.025 inches.

A laser processing method that can reduce warpage occurring in a glass and reduce a stress generated on the glass at a time of releasing a protective material from the glass. The laser processing method includes: forming the protective materials on both surfaces of the glass; processing the glass by radiating a laser beam onto the glass together with the protective materials after the protective material formation; and releasing the protective materials from the glass after the laser processing.

Provided is a method for manufacturing a transparent member that can increase the number of transparent members obtained from a transparent substrate as a base material. A method for manufacturing a transparent member includes: a first step of forming a plurality of through holes 3 in a transparent substrate 2; and a second step of separating the transparent substrate 2 along an imaginary line X1, Y1 connecting centers of the plurality of through holes 3, thus obtaining a transparent member.

Glass web including a first glass-web portion (30), a second portion (40), and a splice joint (50) coupling the first glass-web portion to the second portion, wherein the slice joint includes a splice member (60) with at least one gas-permeable attachment portion. In further examples, methods of splicing a first glass-web portion to a second portion include the step of splicing the first glass-web portion to the second portion with a splice member, wherein the step of splicing includes attaching a gas-permeable attachment portion of the splice member to the first glass-web portion.

Glass web including a first glass-web portion (30), a second portion (40), and a splice joint (50) coupling the first glass-web portion to the second portion, wherein the slice joint includes a splice member (60) with at least one gas-permeable attachment portion. In further examples, methods of splicing a first glass-web portion to a second portion include the step of splicing the first glass-web portion to the second portion with a splice member, wherein the step of splicing includes attaching a gas-permeable attachment portion of the splice member to the first glass-web portion.

An electronic device is provided with a display such as a liquid crystal display. The display has a layer of liquid crystal material sandwiched between an upper display layer such as a color filter layer and a lower display layer such as a thin-film-transistor layer. An upper polarizer is formed on the upper surface of the color filter layer. A lower polarizer is formed on the lower surface of the thin-film-transistor layer. To protect display layers such as the color filter layer and the thin-film-transistor layer, a coating is deposited on a peripheral edge of the display layer. A laser is used to cut through portions of the polarizer that overhang the display layer while also cutting through the coating on the peripheral edge of the display layer. Following laser trimming operations, the coating is flush with an edge surface of the polarizer.