The present application describes a system for cutting a substrate (102) that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum and will include an edge when extracted from a sheet of substrate (102). The system generally includes a laser (104) capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate (102) is transparent; an optical device (106) positioned in the light path of the laser; and an interface block (108) composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate (102) is also transparent, wherein said interface block (108) is positioned in said light path and between the substrate (102) and said optical element (108).

A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 m and about 6.0 mm.

A method and a device for cutting a laminate including at least one glass layer with a thickness less than or equal to 0.3 mm and including at least one polymeric layer are disclosed. The method includes generating a surface scratch on a first surface of the glass layer, wherein the scratch, starting from a lateral edge, extends along a cutting line. The method further includes moving a first laser beam, starting from the scratch, across the first surface along the cutting line. The method also includes cooling the glass layer along the cutting line, wherein the glass layer breaks along the cutting line The polymeric layer is severed by moving a second laser beam along the cutting line. The device includes means for cutting the laminate according to the disclosed method.

An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.

Disclosed are a cutting method of flexible display panel, a controlling device in the cutting method and a cutting apparatus of flexible display panel. The cutting method comprises steps of placing a transparent substrate (21) carried with a flexible film layer (22) on a base (10); cutting only the transparent substrate (21) by means of a cutting tool (30); obtaining a cutting trace of the cutting tool (30); and controlling a laser knife (40) to cut the flexible film layer (22) carried on the transparent substrate (21) along the cutting trace of the cutting tool cutting the transparent substrate. In this way, by controlling the laser knife (40) to cut the flexible film layer (22) disposed on the transparent substrate (21) following the cutting trace of the cutting tool (30) cutting the transparent substrate (21), the flexible film layer (22) can be completely cut at the same time when or after the transparent substrate (21) is completely cut, so as to avoid rough selvedges during cutting the flexible film layer (22), thereby improving the cutting effect of cutting the flexible display panel; besides, in case that the cutting tool (30) and the laser knife (40) operate in parallel cutting mode, it can also improve the cutting efficiency.

An apparatus for cutting laminated glass and film-covered glass includes a powered hand-held tool with a blade set including two static cutting blades and one dynamic, reciprocating cutting blade. The reciprocating cutting blade moves between the two static cutting blades which are rigidly mounted to the tool head. The left and right static cutting blades were spaced apart by about 0.250 inches, and the cutting blade had a thickness of about 0.200-0.250 inches. The clearance between the reciprocating and each static blade is between about 0.005-0.025 inches.

A method includes: providing a plate-like glass element having side faces and an ultrashort pulse laser having a laser beam; directing the laser beam onto one of the side faces; concentrating the laser beam by focusing optics to form an elongated focus in the glass element; producing a filament-shaped flaw in a volume of the glass element by a radiated-in energy of the laser beam, a longitudinal direction of which runs transverse to one of the side faces, and the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses to produce the filament-shaped flaw; widening the filament-shaped flaw to form a channel by exposing the glass element to an etching including an etching medium which removes glass at a rate of less than 8 m per hour; and introducing rounded, hemispherical depressions in a wall of the channel by the etching.

Thin glass in cell unit (4) manufactured by glass cutting and post-processing methods according to the present invention is the thin glass in cell unit (4) installed on the front surface of an electronic device or a display unit of an electronic device, wherein a bevel-shaped cut portion (41) is formed at an end of one side of the thin glass in cell unit (4) in contact with the front surface of the display unit. In addition, the bevel-shaped cut portion (41) has a height (H) of 5% or more and 50% or less of a thickness of the thin glass in cell unit (4). In addition, the bevel-shaped cut portion (41) has a width (W) of 10% or more and 300% or less of the thickness of the thin glass in cell unit (4), and the thin glass in cell unit (4) is bent toward the front of the display unit.

A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: a resin removing step of irradiating the resin layer with a laser beam oscillated from a first laser source along a scheduled dividing line of the composite material to form a processing groove along the scheduled dividing line; a brittle material removing step of irradiating the brittle material layer with a laser beam oscillated from an ultrashort pulsed laser source along the scheduled dividing line to form a processing mark along the scheduled dividing line; and a brittle material layer dividing step of generating thermal stress in the brittle material layer by irradiating the brittle material layer with a laser beam oscillated from a second laser source from the opposite side to the resin layer to thereby divide the brittle material layer.

A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength , a spot size w.sub.o, and a Rayleigh range Z.sub.R that is greater than $F_D\frac{w_o^2}{},$
where F.sub.D is a dimensionless divergence factor.