A method for producing an intermediate glass plate includes a defect formation step, a separation step, and a polishing step. In the defect formation step, a defect is formed on main surfaces of glass blanks by irradiating a laminate of the glass blanks with a laser beam from one side in a lamination direction in which the glass blanks are laminated, along the lamination direction, and moving the laser beam relative to the laminate such that a circle is drawn in a view from the main surfaces of the glass blanks. In the separation step, a cylindrical laminate is formed by separating a removal target portion along the defect while maintaining the laminate. In the polishing step, a side wall surface of the laminate is polished while maintaining the cylindrical laminate so as to obtain a disk-shaped intermediate glass plate that has been subjected to edge surface polishing.

A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

A method for separating a thin glass, in which method the thin glass is progressively heated along a path which forms a parting line, wherein the heating of the glass is realized by way of the energy of at least one energy source within an area of action of the energy source on the thin glass, and, by way of a temperature gradient of the glass heated by way of the at least one energy source in relation to the surrounding glass, a mechanical stress is generated in the glass, by way of which mechanical stress, a crack propagates, following the mechanical stress, along the parting line.

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.

A method of cutting thin flexible glass substrates utilizing a feedback loop configured to monitor a position of a crack tip relative to an irradiated zone on the glass substrate. A process controller including the feedback loop controls at least one of a laser beam power, a laser speed or a cooling fluid speed based on the distance between the crack tip and the irradiated zone.

Provided is a cleaving method for a glass film (G) including: cleaving, during conveyance of the glass film (G) in a predetermined direction, the glass film (G) continuously along a preset cleaving line (8) extending in a predetermined conveying direction (a) by a thermal stress generated through localized heating performed along the preset cleaving line (8) and through cooling of a locally heated region (H); dividing the glass film (G) in a width direction of the glass film (G); diverting, after the dividing, adjacent divided glass films (10), which are obtained by the dividing, so that the adjacent divided glass films (10) are separated in a front and rear direction of the adjacent divided glass films; and forming a predetermined widthwise clearance between the adjacent divided glass films after the dividing of the glass film (G) and before the diverting of the adjacent divided glass films (10).

Methods and apparatus provide for sourcing a glass web, the glass web having a length and a width transverse to the length; continuously moving the glass web from the source to a destination in a transport direction along the length of the glass web; and cutting the glass web at a cutting zone into at least first and second glass ribbons as the glass web is moved from the source to the destination, the first glass ribbon having a first width and the second glass ribbon having a second width, where the first and second widths are not equal.

A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimetres between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.

A method for cutting a transparent brittle material using pulsed laser-radiation is disclosed. A beam of pulsed laser-radiation having an optical-axis is focused in the material by a variable-focus lens or mirror. The focus is translated along the optical-axis while the material is moved with respect to the beam to create an array of defects along a cutting path.