Patent classifications
C03B33/102
Laser beam cutting/shaping a glass substrate
An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.
METHOD FOR MANUFACTURING GLASS ROLL
Provided is a method of producing a glass roll including: a conveying step of conveying a glass film (G) along a longitudinal direction thereof; a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) by the conveying step, to thereby separate the glass film (G) into a non-product portion (Gc) and a product portion (Gd); and a take-up step of taking up the product portion (Gd) into a roll shape, to thereby form a glass roll (R). The cutting step includes a step of winding a thread-like peeled material (Ge) generated from an end portion of the product portion (Gd) in a width direction around a rod-shaped collecting member (23), and leading the wound thread-like peeled material (Ge) in a predetermined conveying direction (PX) by a leading device (24).
APPARATUSES AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING NON-AXISYMMETRIC BEAM SPOTS
A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , an effective spot size w.sub.o,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range Z.sub.Rx,min in an x-direction and a minimum Rayleigh range Z.sub.Ry,min in a y-direction. Further, the smaller of Z.sub.Rx,min and Z.sub.Ry,min is greater than F.sub.Dw.sub.0,eff.sup.2/, where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.
Laser processing method and laser processing apparatus
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
Edge polishing a glass substrate after cutting
A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , an effective spot size w.sub.o,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range Z.sub.Rx,min in an x-direction and a minimum Rayleigh range Z.sub.Ry,min in a y-direction. Further, the smaller of Z.sub.Rx,min and Z.sub.Ry,min is greater than
where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.
LASER CUTTING HEAD FOR CUTTING HARD, BRITTLE PRODUCTS AND LASER CUTTING DEVICE THEREOF
The present disclosure relates to a laser cutting field, and in particular to a laser cutting head for cutting hard, brittle products and a laser cutting device for cutting hard, brittle products. The laser cutting head includes a polarizing element, a binary phase element and a focusing element. The polarizing element, the binary phase element and the focusing element are disposed in sequence. The polarizing element, the binary phase element, and the focusing element are structured and configured together such that a laser light is configured to pass through the polarizing element to form a polarizing laser light that is emitted to the binary phase element, the binary phase element modulating phase of the polarizing laser light. A diffractive laser light is formed in a location of the binary phase element, which is emitted to the focusing element.
DRINKING IMPLEMENT WITH HIGH STRENGTH
A drinking implement includes: a first opening; a lumen; a second opening fluidly coupled to the first opening and the lumen; and a wall including a glass and extending from the first opening to the second opening and surrounding the lumen. The wall has an inner surface facing toward the lumen and an outer surface facing away from the lumen. The wall has a first compressive stress layer extending from the inner surface to a first depth within the wall, a second compressive stress layer extending from the outer surface to a second depth within the wall, and a tensile stress layer disposed within the wall at a depth between the first compressive stress layer and the second compressive stress layer. The second depth is from 0.05% to 25% of a thickness of the wall.
High speed and high power laser scribing methods and systems
A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.
ROTATING LIGHT SOURCE UTILIZED TO MODIFY SUBSTRATES
A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.