Patent classifications
C03B33/102
METHOD AND APPARATUS FOR PRODUCING GLASS PRECURSORS AND GLASS PRODUCTS
A method and apparatus for producing glass products from tubular glass precursors is provided. In particular, a method and apparatus for separating tube glass into sized glass tube portions, produced glass tube portions, glass precursor portions, or glass product portions, and their use as pharmaceutical packaging are provided. The tube glass or the glass precursor or the glass product is provided with filaments along predetermined breaking planes. The filaments extend obliquely to the local wall radius and allow for clean separation of the tube glass or the glass precursor or the glass product.
EDGE POLISHING A GLASS SUBSTRATE AFTER CUTTING
A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.
LASER BEAM CUTTING/SHAPING A GLASS SUBSTRATE
An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.
SHAPING A GLASS SUBSTRATE AFTER CUTTING
A method includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.
LASER FILAMENTATION
The invention relates to a method and a device for separating the excess glass (32) in the production of hollow glass products (12), wherein the method comprises: centring a hollow glass product (12) in a receiving device (10), which is designed to hold the hollow glass (12) and to rotate about a rotational axis in such a way that a separation line (24) along which the excess glass (32) is to be separated from the hollow glass product (12) to be produced is centred in relation to the rotational axis; processing the hollow glass product (12) in a plurality of positions along the separation line (24) by means of a laser beam in order to generate local filaments with a weakened glass structure during a rotation of the hollow glass product (12) about the rotational axis; and introducing energy along the separation line (24) in order to separate the excess glass (32) along the weakened glass structure.
Laser-based modification of transparent materials
In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.
Laser system and process with buffer material
A laser system includes a buffer material at an entry surface of a substrate in which laser-induced channels are formed. The laser beam propagates through the buffer material and impinges the substrate with a central axis of the laser beam at an oblique angle of incidence. The buffer material has a refractive index that may be closer to that of the substrate than is the refractive index of the atmosphere, such as air, in which the laser system operates. The buffer material facilitates forming laser-induced channels at relative large angles with respect to the substrate surface by attenuating energy loss or other effects on the laser beam that are normally caused by the mismatch in refractive index between the environment and the substrate in the absence of the buffer material.
Method for manufacturing disk-shaped glass blank and method for manufacturing glass substrate for magnetic disk
A glass blank is cut out from a glass plate by forming a crack starting portion inside the glass plate by moving a first laser beam relative to the glass plate such that a focal position of the laser beam is located in an inner portion of the glass plate in its thickness direction and the focal position forms a circle when viewed from a surface of the glass plate, then causing cracks to develop from the crack starting portion toward main surfaces of the glass plate, and splitting the glass plate to separate, from the glass plate, a glass blank that includes a separation surface having an arithmetic average surface roughness Ra smaller than 0.01 ?m and a roundness not larger than 15 ?m. Thereafter, main surfaces of the glass blank are ground or polished.
Laser dicing glass wafers using advanced laser sources
A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 ?m to about 5 ?m.
Method for separating a glass element and glass sub-element
The present disclosure relates to a method for at least section-wise separating a glass element into at least two glass sub-elements along a separation face and a glass sub-element which is manufactured and/or can be manufactured in particular by the method according to the disclosure.