Embodiments are directed to systems for laser cutting at least one glass article comprising a pulsed laser assembly and a glass support assembly configured to support the glass article during laser cutting within the pulsed laser assembly, wherein the pulsed laser assembly comprises at least one non-diffracting beam (NDB) forming optical element configured to convert an input beam into a quasi-NDB beam; and at least one beam transforming element configured to convert the quasi-NDB beam into multiple quasi-NDB sub-beams spaced apart a distance of about 1 m to about 500 m; wherein the pulsed laser assembly is oriented to deliver one or more pulses of multiple quasi-NDB sub-beams onto a surface of the glass article, wherein each pulse of multiple quasi-NDB sub-beams is operable to cut a plurality of perforations in the glass article.

A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Embodiments are directed to systems for laser cutting at least one glass article comprising a pulsed laser assembly and a glass support assembly configured to support the glass article during laser cutting within the pulsed laser assembly, wherein the pulsed laser assembly comprises at least one non-diffracting beam (NDB) forming optical element configured to convert an input beam into a quasi-NDB beam; and at least one beam transforming element configured to convert the quasi-NDB beam into multiple quasi-NDB sub-beams spaced apart a distance of about 1 m to about 500 m; wherein the pulsed laser assembly is oriented to deliver one or more pulses of multiple quasi-NDB sub-beams onto a surface of the glass article, wherein each pulse of multiple quasi-NDB sub-beams is operable to cut a plurality of perforations in the glass article.

Provided is a cutting method for a tube glass, including: a heating step of heating a preset cut portion (CP) of the tube glass (G2) by radiating laser light (L11) to the preset cut portion (CP); an inner crack region forming step of forming an inner crack region (C1) including one or a plurality of cracks through multiphoton absorption that occurs in an irradiation region of laser light (L12) by radiating the laser light (L12) having a focal point adjusted to an inside of the preset cut portion (CP); and a cooling step of cooling the preset cut portion (CP), to thereby cause the cracks to propagate in the inside of the preset cut portion (CP).

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

The present disclosure relates to a method for at least section-wise separating a glass element into at least two glass sub-elements along a separation face and a glass sub-element which is manufactured and/or can be manufactured in particular by the method according to the disclosure.

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , an effective spot size w.sub.o,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range Z.sub.Rx,min in an x-direction and a minimum Rayleigh range Z.sub.Ry,min in a y-direction. Further, the smaller of Z.sub.Rx,min and Z.sub.Ry,min is greater than

[00001]$F_D.Math.\frac{.Math..Math.w_{0,\mathrm{eff}}^2}{},$

where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater.

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO.sub.2 laser for fully automated separation.