C03C3/06

PROCESS FOR THE PREPARATION OF FLUORINATED QUARTZ GLASS

A process for the production of a fluorinated quartz glass including the steps of generating SiO.sub.2 particles in a synthesis burner; depositing the resulting SiO.sub.2 particles into a body; and vitrifying the resulting body, wherein a fluorinating agent having a boiling point greater than or equal to −10° C. is supplied to the synthesis burner.

PROCESS FOR THE PREPARATION OF FLUORINATED QUARTZ GLASS

A process for the production of a fluorinated quartz glass including the steps of generating SiO.sub.2 particles in a synthesis burner; depositing the resulting SiO.sub.2 particles into a body; and vitrifying the resulting body, wherein a fluorinating agent having a boiling point greater than or equal to −10° C. is supplied to the synthesis burner.

METHOD OF MANUFACTURING OPAQUE QUARTZ GLASS

A method for manufacturing a large sized opaque quartz glass ingot having excellent heat ray shielding and light blocking properties without using a foaming agent. The obtained opaque quartz glass has small diameter spherical bubbles and a preferable mechanical strength. Silica powder is dispersed in water to form a slurry having a silica powder concentration of 45 to 75 wt % and the average particle size of the silica powder is adjusted to 8 μm or less and the standard deviation of the particle size is adjusted to 6 μm or more by wet pulverization. The slurry is sprayed for forming granules of the silica powder. An opaque quartz glass ingot with a small bubble diameter and high mechanical strength is obtained by melting the granulated silica powder.

METHOD OF MANUFACTURING OPAQUE QUARTZ GLASS

A method for manufacturing a large sized opaque quartz glass ingot having excellent heat ray shielding and light blocking properties without using a foaming agent. The obtained opaque quartz glass has small diameter spherical bubbles and a preferable mechanical strength. Silica powder is dispersed in water to form a slurry having a silica powder concentration of 45 to 75 wt % and the average particle size of the silica powder is adjusted to 8 μm or less and the standard deviation of the particle size is adjusted to 6 μm or more by wet pulverization. The slurry is sprayed for forming granules of the silica powder. An opaque quartz glass ingot with a small bubble diameter and high mechanical strength is obtained by melting the granulated silica powder.

QUARTZ FIBRE WITH HYDROGEN BARRIER LAYER AND METHOD FOR THE PRODUCTION THEREOF
20220227657 · 2022-07-21 ·

A method of manufacturing a quartz glass fibre includes producing a quartz glass primary preform by modified chemical vapor deposition (MCVD) in a quartz glass substrate tube and inserting the quartz glass primary preform into a glass jacketing tube. Defect-generating UV radiation is irridiated into the cross-sectional area of the glass jacketing tube while combining the quartz glass primary preform with the glass jacketing tube in the jacketing process to form a cladding layer to a secondary preform. A quartz glass fibre is pulled from the secondary preform.

QUARTZ FIBRE WITH HYDROGEN BARRIER LAYER AND METHOD FOR THE PRODUCTION THEREOF
20220227657 · 2022-07-21 ·

A method of manufacturing a quartz glass fibre includes producing a quartz glass primary preform by modified chemical vapor deposition (MCVD) in a quartz glass substrate tube and inserting the quartz glass primary preform into a glass jacketing tube. Defect-generating UV radiation is irridiated into the cross-sectional area of the glass jacketing tube while combining the quartz glass primary preform with the glass jacketing tube in the jacketing process to form a cladding layer to a secondary preform. A quartz glass fibre is pulled from the secondary preform.

LOW DIELECTRIC RESIN SUBSTRATE

The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.

ANNEALED QUARTZ GLASS CLOTH AND METHOD FOR MANUFACTURING SAME

The present invention is an annealed quartz glass cloth that has an SiO.sub.2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.

ANNEALED QUARTZ GLASS CLOTH AND METHOD FOR MANUFACTURING SAME

The present invention is an annealed quartz glass cloth that has an SiO.sub.2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.

Method for fabricating microfluidic devices in fused silica by picosecond laser irradiation
11203083 · 2021-12-21 · ·

Method of fabricating a microfluidic device by means of inducing internal cracks in fused silica employing a picosecond laser beam, firstly utilizing irradiation of a focused temporally controlled picosecond laser beam in fused silica to generate a spatially selective modification region including randomly oriented nanocracks, then employing chemical etching to remove the irradiated area and obtain a hollow and connected three-dimensional microstructure, thereby achieving three-dimensional fabrication of microchannel structures inside the fused silica. The method can realize polarization insensitive three-dimensional uniform etching by regulating the pulse width of the picosecond laser beam, and has high chemical etch rate and selectivity, applicable for fabrication of large-sized three-dimensional microfluidic systems, high-precision 3D glass printing, etc.