The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal, and a lead-tellurium-lithium-oxide dispersed in an organic medium.

Optically transparent glass ceramic materials comprising a glass phase containing and a crystalline tungsten bronze phase comprising nanoparticles and having the formula M.sub.xWO.sub.3, where M includes at least one H, Li, Na, K, Rb, Cs, Ca, Sr, Ba, Zn, Cu, Ag, Sn, Cd, In, Tl, Pb, Bi, Th, La, Pr, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb, Lu, and U, and where 0<x<1. Aluminosilicate and zinc-bismuth-borate glasses comprising at least one of Sm.sub.2O.sub.3, Pr.sub.2O.sub.3, and Er.sub.2O.sub.3 are also provided.

A glass frit includes Bi.sub.2O.sub.3 and has a glass transition temperature (Tg) in a range of 280 C. to 320 C. A display device includes the glass frit including Bi.sub.2O.sub.3 and the glass transition temperature (Tg) in the range of 280 C. to 320 C. The display device shows excellent internal reliability and drop strength.

A composition for forming an electrode includes a conductive powder, a glass frit, an organic vehicle, and a burn-out retardant. The burn-out retardant exhibits a residual carbon of greater than or equal to about 1 wt % at a temperature of about 600 C. based on the initial amount of 100 wt % and an exothermic peak at about 200 C. to about 500 C.

The present invention discloses a glass ceramic for excitation of high-power semiconductor light source. An expression of constitution of the glass ceramic is (1x)A: xB, wherein x as a weight percentage of B, is ranging from 1% to 30%; A as a precursor glass, has a composition of aSb.sub.2O.sub.3-bB.sub.2O.sub.3-cZnO-dM.sub.2O, a, b, c, d being molar percentages, a+b+c+d=100%, M among M.sub.2O represents an alkali metal, and M.sub.2O is an alkali metallic oxide or an alkali metallic carbonate; and B is a YAG:Ce.sup.3+ fluorescent powder. The precursor glass provided by the present invention has a relatively low remelting temperature, without devitrification during the process of preparing the final products or absorption of blue light. The product glass ceramic has a luminous efficiency of 300 lm/W to 400 lm/W. A white light semiconductor light source is prepared by the product glass ceramic in combination with the high-power blue light semiconductor light source A preparation method provided by the present invention has advantages such as low cost, excellent performances, and being green, pollution-free and suitable for the large-scale industrial production. The present invention can be applied in the field of illumination light source and display light source, such as head-lights of vehicles, searchlights, projectors and laser cinemas.

The lead-free glass composition contains vanadium oxide, tellurium oxide, alkaline metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO.sub.2. A content of the alkaline metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide R.sub.2O (R: alkali metal element).

The present invention relates to a tellurium-oxide-based glass composition for forming a glass-to-metal seal to alloys or metals having a coefficient of thermal expansion higher than 16 ppm/ C., said composition comprising TeO.sub.2, ZnO, TiO.sub.2 and optionally K.sub.2O and being essentially free of lead oxide, sodium oxide and vanadium oxide.

In addition it relates to the use of the glass composition according to the invention to form a glass-to-metal seal between copper or a copper alloy and an alloy or a metal having a coefficient of thermal expansion higher than 16 ppm/ C., in particular aluminum alloys.

It furthermore relates to a connector comprising a contact made of copper or of copper alloy, an insert and/or shell made of a metal or alloy having a coefficient of thermal expansion higher than 16 ppm/ C. and, by way of glass-to-metal sealant between the contact and the insert and/or shell, a tellurium-oxide-based glass having the composition according to the invention.

Lastly, it relates to a process for forming a glass-to-metal seal between a contact made of copper or of copper alloy and an insert and/or shell made of metal or alloy having a coefficient of thermal expansion higher than 16 ppm/ C.

A UV-transmitting glass formed of a multi-component oxide, and having at least one of characteristics of an internal transmittance ?.sub.350-400 (%) with respect to light having a wavelength between 350 nm and 400 nm through a 10 mm-thick glass that satisfies ?.sub.350-400?90 . . . (1); an internal transmittance ?.sub.300-350 (%) with respect to light having a wavelength between 300 nm and 350 nm through a 10 mm-thick glass that satisfies ?.sub.300-350?75 . . . (2); and an internal transmittance ?.sub.260-300 (%) with respect to light having a wavelength between 260 nm and 300 nm through a 10 mm-thick glass that satisfies ?.sub.260-300?45 . . . (3).

A glass frit according to this application may include a composition of P.sub.2O.sub.5, V.sub.2O.sub.5, TeO.sub.2, CuO, ZnO, and BaO configured to replace a conventional lead glass composition and enable a low temperature calcination. A coefficient of thermal expansion (CTE) of the glass frit may be matched with that of a glass substrate. The composition may not include an inorganic filler or at least reduce a content of an inorganic filler to reduce or prevent separation and breakage and to improve durability. The glass frit may be used as a paste for a vacuum glass assembly.

Certain example embodiments of this invention relate to vacuum insulating glass (VIG) units having improved seals made using two different frit-based edge seal materials, and/or methods of making the same. In certain example embodiments, a first frit material is applied around peripheral edges of first and second glass substrates. The first frit material, which may be bismuth-based in certain example embodiments, is fired with a heat treatment (e.g., thermal tempering) process. A second frit material, which may be VBZ-based in certain example embodiments, is applied and at least partially overlaps with the fired first frit material. The first frit material acts as a primer, and the second frit material helps seal together the VIG unit. The second frit material is fired at a significantly lower temperature that enables the glass to retain the temper or other strength imparted by the heat treatment.