A method of forming a dissolvable part of amorphous borate includes: preparing a mixture comprising one or more boron compounds and one or more alkali compounds, at least one of the one or more boron compounds and the one or more alkali compounds being hydrous; heating the mixture to a melting temperature for a predetermined time to melt the mixture and release water from the mixture to form an anhydrous boron compound that is moldable, wherein the amount of alkali compound being selected to achieve an alkali oxide content of between about 10 to 25%; with the anhydrous boron compound at a molding temperature, molding the anhydrous boron compound in a mold; and cooling the anhydrous boron compound to form a solid.

A method of forming a dissolvable part of amorphous borate includes: preparing a mixture comprising one or more boron compounds and one or more alkali compounds, at least one of the one or more boron compounds and the one or more alkali compounds being hydrous; heating the mixture to a melting temperature for a predetermined time to melt the mixture and release water from the mixture to form an anhydrous boron compound that is moldable, wherein the amount of alkali compound being selected to achieve an alkali oxide content of between about 10 to 25%; with the anhydrous boron compound at a molding temperature, molding the anhydrous boron compound in a mold; and cooling the anhydrous boron compound to form a solid.

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.

A method of forming a dissolvable part of amorphous borate includes: preparing a mixture comprising one or more boron compounds and one or more alkali compounds, at least one of the one or more boron compounds and the one or more alkali compounds being hydrous; heating the mixture to a melting temperature for a predetermined time to melt the mixture and release water from the mixture to form an anhydrous boron compound that is moldable, wherein the amount of alkali compound being selected to achieve an alkali oxide content of between about 10 to 25%; with the anhydrous boron compound at a molding temperature, molding the anhydrous boron compound in a mold; and cooling the anhydrous boron compound to form a solid.

A method of forming a dissolvable part of amorphous borate includes: preparing a mixture comprising one or more boron compounds and one or more alkali compounds, at least one of the one or more boron compounds and the one or more alkali compounds being hydrous; heating the mixture to a melting temperature for a predetermined time to melt the mixture and release water from the mixture to form an anhydrous boron compound that is moldable, wherein the amount of alkali compound being selected to achieve an alkali oxide content of between about 10 to 25%; with the anhydrous boron compound at a molding temperature, molding the anhydrous boron compound in a mold; and cooling the anhydrous boron compound to form a solid.

A glass composition according to an embodiment of the present invention includes, in mol %, from 1 to 20% of B.sub.2O.sub.3, from 30 to 80% of TeO.sub.2, and from 5 to 30% of MoO.sub.3 as glass composition.

A glass composition according to an embodiment of the present invention includes, in mol %, from 1 to 20% of B.sub.2O.sub.3, from 30 to 80% of TeO.sub.2, and from 5 to 30% of MoO.sub.3 as glass composition.

A method of forming a dissolvable part of amorphous borate includes: preparing a mixture comprising one or more boron compounds and one or more alkali compounds, at least one of the one or more boron compounds and the one or more alkali compounds being hydrous; heating the mixture to a melting temperature for a predetermined time to melt the mixture and release water from the mixture to form an anhydrous boron compound that is moldable, wherein the amount of alkali compound being selected to achieve an alkali oxide content of between about 10 to 25%; with the anhydrous boron compound at a molding temperature, molding the anhydrous boron compound in a mold; and cooling the anhydrous boron compound to form a solid.

A method of forming a dissolvable part of amorphous borate includes: preparing a mixture comprising one or more boron compounds and one or more alkali compounds, at least one of the one or more boron compounds and the one or more alkali compounds being hydrous; heating the mixture to a melting temperature for a predetermined time to melt the mixture and release water from the mixture to form an anhydrous boron compound that is moldable, wherein the amount of alkali compound being selected to achieve an alkali oxide content of between about 10 to 25%; with the anhydrous boron compound at a molding temperature, molding the anhydrous boron compound in a mold; and cooling the anhydrous boron compound to form a solid.