Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

The invention relates to infrared devices, which contain at least two optical elements that are bonded together by a low-temperature melting glass which possesses transparency in the infrared spectrum, and methods of preparation and use of said infrared devices.

The invention relates to infrared devices, which contain at least two optical elements that are bonded together by a low-temperature melting glass which possesses transparency in the infrared spectrum, and methods of preparation and use of said infrared devices.

The present disclosure provides a wavelength conversion glass, a method for manufacturing the wavelength conversion glass, and a light emitting device including the wavelength conversion glass. The wavelength conversion glass includes a TeO.sub.2B.sub.2O.sub.3ZnOBaO-based transparent glass containing tellurium dioxide (TeO.sub.2), boric oxide (B.sub.2O.sub.3), zinc oxide (ZnO), and barium oxide (BaO); and phosphor micro-particles dispersed in the transparent glass.

Disclosed as a lead-free, inorganic low melting-point composition which, when applied to an object to be sealed having surfaces made of inorganic oxide and/or metal, and then subjected to heat treatment in the air in a temperature range not exceeding 400 C., sufficiently expands over the surfaces exhibiting good wettability to it, and thus is able to adhere (stick fast) to the surfaces and seal them once cooling down and making solid, and also to join two of their surfaces which are laid on each other.

Disclosed as a lead-free, inorganic low melting-point composition which, when applied to an object to be sealed having surfaces made of inorganic oxide and/or metal, and then subjected to heat treatment in the air in a temperature range not exceeding 400 C., sufficiently expands over the surfaces exhibiting good wettability to it, and thus is able to adhere (stick fast) to the surfaces and seal them once cooling down and making solid, and also to join two of their surfaces which are laid on each other.

The present disclosure provides a glass composition that include from about 50 mol % to about 95 mol % of B2O3; from about 5 mol % to about 50 mol % of one or more glass components selected from the group consisting of: Li2O, Rb2O, K2O, Na2O, SrO, CaO, MgO, and ZnO. The glass composition includes less than 30 mol % of Rb2O. The glass composition is a quaternary system. The glass composition is a particulate material that includes particles that are from about 1 to about 50 ?m in size. The glass composition loses at least 5 mass % within 24 hours when exposed to a buffered saline solution. The glass composition may be used to desensitize dentin. The present disclosure also provides a dentin-desensitizing composition.

The present disclosure provides a glass composition that include from about 50 mol % to about 95 mol % of B2O3; from about 5 mol % to about 50 mol % of one or more glass components selected from the group consisting of: Li2O, Rb2O, K2O, Na2O, SrO, CaO, MgO, and ZnO. The glass composition includes less than 30 mol % of Rb2O. The glass composition is a quaternary system. The glass composition is a particulate material that includes particles that are from about 1 to about 50 ?m in size. The glass composition loses at least 5 mass % within 24 hours when exposed to a buffered saline solution. The glass composition may be used to desensitize dentin. The present disclosure also provides a dentin-desensitizing composition.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.