The present disclosure relates to a low temperature-calcined lead-free glass frit and paste, and a vacuum glass assembly using the same. The glass frit according to the present disclosure has a novel component system comprising V.sub.2O.sub.5, TeO.sub.2, CuO, BaO, one or more of Ag.sub.2O and Bi.sub.2O.sub.3, ZnO, and one or more of SnO and MoO.sub.3 at a characteristic composition ratio according to the disclosure, whereby the glass frit can replace a lead-based glass composition of the related art, can be calcined at a low temperature of 350° C. or lower and can ensure excellent chemical durability.

The present disclosure relates to a low temperature-calcined lead-free glass frit and paste, and a vacuum glass assembly using the same. The glass frit according to the present disclosure has a novel component system comprising V.sub.2O.sub.5, TeO.sub.2, CuO, BaO, one or more of Ag.sub.2O and Bi.sub.2O.sub.3, ZnO, and one or more of SnO and MoO.sub.3 at a characteristic composition ratio according to the disclosure, whereby the glass frit can replace a lead-based glass composition of the related art, can be calcined at a low temperature of 350° C. or lower and can ensure excellent chemical durability.

The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

A ceramic printing ink is provided that is suitable for application using an inkjet printing process to produce a coating on glass ceramics. The ink includes a glassy material of glass particles and pigment particles. The glass particles are present in a ratio of total weight to the pigment particles of at least 1.5 and less than 19. The glass particles have an equivalent diameter d.sub.90 ranging from at least 0.5 μm to at most 5 μm. The ink has an effective coefficient of linear thermal expansion, α.sub.20-300,eff, in a range from 6.5*10.sup.−6/K to 11*10.sup.−6/K.

Coated glass panes having a glass pane and a coating in at least one region of at least one side of the glass pane. The glass pane is composed of glass with SiO.sub.2 and B.sub.2O.sub.3. The coating includes first coating applied in at least one region of the at least one side. The first coating has a binder with SiO.sub.2 and a pigment. The glass pane, in the at least one region, has a flexural strength between at least 5 and at most 170 MPa.

A composition for enamel may include 20 to 45 wt % of SiO.sub.2; 1 to 15 wt % of B.sub.2O.sub.3, 10 to 20 wt % of one or more of Na.sub.2O, K.sub.2O, and Li.sub.2O, 1 to 5 wt % of NaF, 1 to 10 wt % of ZnO, 5 to 15 wt % of TiO.sub.2, 3 to 7 wt % of MoO.sub.3; 5 to 15 wt % of Bi.sub.2O.sub.3, 1 to 5 wt % of CeO.sub.2, and 1 to 10 wt % of one or more of MnO.sub.2, Fe.sub.2O.sub.3, and Co.sub.3O.sub.4. The composition may be used to coat a cooking appliance for easy removal of contaminants at room temperature.

A ceramic composition includes an antimicrobial glass composition that includes components harmless to the human body and maintains an antimicrobial function semi-permanently. Specifically, the ceramic composition includes a novel antimicrobial glass composition that includes a glass former SiO.sub.2 as a main component, and ZnO and SnO as antimicrobial components.

The glass for covering a semiconductor element contains: in mol %, as a glass composition, SiO.sub.2: 20% to 36%, ZnO: 8% to 40%, B.sub.2O.sub.3: 10% to 24%, Al.sub.2O.sub.3: 10% to 20%, and MgO+CaO: 8% to 22%, in which SiO.sub.2/ZnO is 0.6 or more and less than 3.3 in terms of a molar ratio, and a lead component is substantially not contained.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.