Provided is a glass composition comprising a glass frit containing P.sub.2O.sub.5, SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, ZrO.sub.2 and a group I-based oxide, wherein the P.sub.2O.sub.5 is contained in an amount of 10 to 30% by weight based on a total weight of the glass frit, wherein the SiO.sub.2 is contained in an amount of 20 to 40% by weight based on the total weight of the glass frit, wherein the B.sub.2O.sub.3 is contained in an amount of 5 wt % to 18 wt % based on the total weight of the glass frit, wherein the Al.sub.2O.sub.3 is contained in an amount of 15 to 30% by weight based on the total weight of the glass frit, wherein the ZrO.sub.2 is contained in an amount of 1 wt % to 8 wt % based on the total weight of the glass frit, wherein the Group I-based oxide is contained in an amount of 15 to 30% by weight based on the total weight of the glass frit.

Provided is a glass composition comprising a glass frit containing P.sub.2O.sub.5, SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, ZrO.sub.2 and a group I-based oxide, wherein the P.sub.2O.sub.5 is contained in an amount of 10 to 30% by weight based on a total weight of the glass frit, wherein the SiO.sub.2 is contained in an amount of 20 to 40% by weight based on the total weight of the glass frit, wherein the B.sub.2O.sub.3 is contained in an amount of 5 wt % to 18 wt % based on the total weight of the glass frit, wherein the Al.sub.2O.sub.3 is contained in an amount of 15 to 30% by weight based on the total weight of the glass frit, wherein the ZrO.sub.2 is contained in an amount of 1 wt % to 8 wt % based on the total weight of the glass frit, wherein the Group I-based oxide is contained in an amount of 15 to 30% by weight based on the total weight of the glass frit.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.

Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.

The present disclosure includes carbon-carbon composite articles having multiphase glass oxidation protection coatings for limiting thermal and/or catalytic oxidation reactions and methods for applying multiphase glass oxidation protection coatings to carbon-carbon composite articles.