C03C17/225

ARTICLE INTENDED TO BE TEMPERED THAT IS PROTECTED BY A TEMPORARY LAYER
20200140326 · 2020-05-07 ·

An article includes a glass substrate comprising two main faces defining two main surfaces separated by edges, the substrate bearing a functional coating deposited on at least one portion of a main surface and a temporary protective layer deposited on at least one portion of the functional coating having a thickness of at least 1 micrometer, wherein the temporary protective layer includes an organic polymer matrix and infrared-absorbing materials.

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
20200144536 · 2020-05-07 ·

A display panel may include a first display substrate, a second display substrate disposed over the first display substrate, and a sealing member bonding the first display substrate and the second display substrate. The sealing member may include a frit sealing member including an outer region and an inner region, with the inner region disposed next to an inner side of the outer region and having a first crystallization temperature lower than a second crystallization temperature of the outer region, and an organic sealing member disposed next to an inner side of the frit sealing member.

Glazing having switchable optical properties

A glazing having switchable optical properties is described, including a transparent substrate having an outer surface and an inner surface, a reflection layer on the outer surface and/or on the inner surface and a switchable functional element arranged on the interior side with respect to the reflection layer. The reflection layer contains a material having a refractive index n.sub.R of 1.6 to 2.5. The product of the refractive index n.sub.R and the thickness d of the reflection layer is from 250 nm to 960 nm.

REFLECTIVE GLAZING COMPRISING A THIN LAYER OF SILICON-RICH SILICON NITRIDE

A glass article includes at least one glass substrate on which a stack of layers is deposited. The stack includes at least one layer consisting of a layer of silicon nitride of formulation SiN.sub.x, in which x is less than 1.25. The physical thickness of the SiN.sub.x layer is between 5 and 50 nm. The light reflection of the glass article, measured on the side of the substrate on which the stack is deposited, is greater than 20%.

Dielectric mirror
10620349 · 2020-04-14 · ·

A dielectric mirror includes a coating having alternating high and low index layers. The mirror coating has no metallic reflective layer of Al or Ag in certain example embodiments, and may have film side and/or glass side visible reflection of from about 50-90% (more preferably from about 60-80% and most preferably from about 65-75%) and visible transmission of from about 10-50% (more preferably from about 10-40% or 20-40%) in certain example embodiments.

Heat treatable coated article with carbon-doped zirconium based layer(s) in coating

In certain example embodiments, a coated article includes a carbon-doped zirconium based layer before heat treatment (HT). The coated article is heat treated sufficiently to cause the carbon-doped zirconium oxide and/or nitride based layer to result in a carbon-doped zirconium oxide based layer that is scratch resistant and/or chemically durable. The doping of the layer with carbon (C) has been found to improve wear resistance.

Scratch-resistant and optically transparent materials and articles
10603870 · 2020-03-31 · ·

Embodiments of a scratch-resistant and optically transparent material comprising silicon, aluminum, nitrogen, and optionally oxygen are disclosed. In one or more embodiments, the material exhibits an extinction coefficient (k) at a wavelength of 400 nm of less than about 110.sup.3, and an average transmittance of about 80% or greater, over an optical wavelength regime in the range from about 380 nm to about 780 nm, as measured through the material having a thickness of about 0.4 micrometer. In one or more embodiments, the material comprises an intrinsic maximum hardness of about 12 GPa or greater as measured on a major surface of the material having a thickness of about 400 by a Berkovich Indenter Hardness Test along an indentation depth of about 100 nm or greater, low compressive stress and low roughness (Ra). Articles and devices incorporating the material are also disclosed.

Scratch resistant films and methods of making the same
10590033 · 2020-03-17 · ·

An article is provided which includes a substrate and a film disposed on a surface of the substrate. The film includes an aluminum concentration of about 45 atomic % to about 50 atomic %, a nitrogen concentration of about 26 atomic % to about 46 atomic % and an oxygen concentration of from about 4 atomic % to about 24 atomic %. The substrate comprises a bow of less than about 0.0005 meters.

Coatings for Textured Glass

Electronic devices may be provided with optical components such as displays and sensors that emit and/or detect visible and/or infrared light. The optical components may be mounted in a housing and covered by a textured glass cover layer. The textured glass cover layer may have an antireflection coating formed from a stack of alternating higher index and lower index inorganic dielectric layers. An outermost one of the inorganic dielectric layers may have a hardness greater than quartz to help the antireflection coating resist abrasion. The coating may optionally include a layer of diamond-like carbon to reduce friction and an oleophobic polymer coating to resist fingerprint smudging.

METHOD AND AN APPARATUS FOR PRODUCING A FILM OF CARBON NITRIDE MATERIAL
20200080188 · 2020-03-12 ·

A method of producing a film of carbon nitride material, including the steps of providing a precursor of the carbon nitride material in a reacting vessel and a substrate substantially above the precursor of the carbon nitride material; heating the reacting vessel, the precursor of the carbon nitride material and the substrate at the first predetermined temperature; and quenching the reacting vessel to reach the second predetermined temperature; wherein the film of carbon nitride material is formed on a surface of the substrate during the quenching of the reacting vessel.