A method of UV photobleaching a glass sample having UV-induced colorization is disclosed. The processed includes first irradiating the glass sample with colorizing UV radiation having a colorizing wavelength of λ.sub.C<300 nm to form the colorized glass, which has a pink hue. The method then includes irradiating the colorized glass with bleaching UV radiation having a bleaching wavelength of λ.sub.B, wherein 248 nm≦λ.sub.B≦365 nm, to substantially remove the pink hue.

A method of forming a multi-colored glass substrate comprises: irradiating a first region of a glass substrate with a first high energy source to form a first irradiated glass substrate; and subjecting the irradiated glass substrate to a first heat treatment to form a first heat treated glass substrate, wherein the first heat treated glass substrate comprises a second region having a different transmittance color coordinate in the CIELAB color space, as measured at an article thickness of 1.33 mm under F2 illumination and a 10° standard observer angle, than the first region.

The present invention provides an UV cleaning device of a glass substrate, comprising a lamp box, an UV lamp positioned above inside the lamp box, a transparent shield positioned under the UV lamp, a humidifier positioned under the transparent shield and a power exhaust device under the transparent shield and opposite to the humidifier; in usage, the glass substrate is conveyed to be inside the lamp box, and UV light generated by the UV lamp irradiates on the glass substrate through the shield to clean the glass substrate and a humidity and an oxygen content inside the lamp box are adjusted with the humidifier to make a surface of the glass substrate adsorb one layer of water molecules. The electrons generated as the UV light cleans can be gradually conducted and led out with water molecules to effectively restrain the accumulation of the electrostatic to reduce the phenomenon of electrostatic damage, and meanwhile, the increase of the oxygen content makes the concentration of the activated oxygen atoms increases along with. Accordingly, the result of cleaning the organic objects with the UV light is promoted.

The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

A copper dopant delivery powder comprising a fused silica powder and a Cu.sub.2S powder. A method of making the copper dopant delivery powder. A method of making a copper-doped glass comprising placing a target glass in a container, packing a composite SiO.CuS dopant powder around the target glass and heating the container and SiO.CuS dopant powder to a temperature of between 800° C. and 1150° C. A copper-doped glass comprising a glass comprising copper-doping wherein the copper-doped glass was formed by covering the glass with a fused silica powder and a Cu.sub.2S powder, wherein the fused silica powder and the Cu.sub.2S powder are mixed in varying ratios of Cu.sub.2S to silica represented by the formula (SiO.sub.2).sub.(1-x)(Cu.sub.2S).sub.x and heating to a temperature of between 800° C. and 1150° C.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. Compressive and tensile stress at the interface of the lithium-based glass-ceramic and lithium zinc aluminosilicate glass may be used to frustrate crack propagation in such a composite glass/glass ceramic article. Methods of making composite glass articles comprising such lithium-based glass ceramics and lithium zinc aluminosilicate glasses are also provided.

A method for preparation of a self-cleaning coating solution is provided. The method comprises mixing an aluminium compound with a solution of an ethanol compound to form a solution. Further, the formed solution is subjected to a first magnetic stirring. After the first magnetic stirring a first transparent solution is formed. Further, a stabilizing agent is added to the first transparent solution of the aluminium compound and the ethanol compound. Subsequent to adding the stabilizing agent a translucent solution is formed. Finally, the formed translucent solution is subjected to a second magnetic stirring for forming a homogeneous second transparent solution. The formed second transparent solution is a coating solution

Multicolored glass-based articles and methods of manufacture are disclosed. The method includes forming a glass-based part and exposing a first region to radiation and a second region to radiation such that the first and second regions have different sized metallic nanoparticles, resulting in a multicolored glass article.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.