C03C23/0025

ARTICLES AND METHODS OF FORMING VIAS IN SUBSTRATES
20170352553 · 2017-12-07 ·

Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

Laser processing method and laser processing apparatus

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

UV photobleaching of glass having UV-induced colorization

A method of UV photobleaching a glass sample having UV-induced colorization is disclosed. The processed includes first irradiating the glass sample with colorizing UV radiation having a colorizing wavelength of λ.sub.C<300 nm to form the colorized glass, which has a pink hue. The method then includes irradiating the colorized glass with bleaching UV radiation having a bleaching wavelength of λ.sub.B, wherein 248 nm≦λ.sub.B≦365 nm, to substantially remove the pink hue.

METHOD OF MANUFACTURING GLASS SUBSTRATE HAVING PENETRATING STRUCTURE, AND GLASS SUBSTRATE

A method of manufacturing a glass substrate having a penetrating structure, the method includes: (1) preparing a glass substrate that has a first surface and a second surface opposite to each other, and includes 3 mol % to 30 mol % of B.sub.2O.sub.3 in terms of oxide; (2) having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure; (3) wet etching the glass substrate having the initial penetrating structure formed; (4) polishing the wet-etched glass substrate from the first surface side, by using an abrasive including acid-soluble abrasive grains; and (5) cleaning the glass substrate with an acid solution.

ANTI-COUNTERFEITING MEASURES FOR GLASS ARTICLES

A glass container including a body having a delamination factor less than or equal to 10 and at least one marking is described. The body has an inner surface, an outer surface, and a wall thickness extending between the outer surface and the inner surface. The marking is located within the wall thickness. In particular, the marking is a portion of the body having a refractive index that differs from a refractive index of an unmarked portion of the body. Methods of forming the marking within the body are also described.

METHOD FOR PRODUCING AN IMPLANT FOR INSERTING INTO AN EYE, IN PARTICULAR FOR INSERTING INTO THE SCHLEMM'S CANAL OF AN EYE
20230174415 · 2023-06-08 ·

Exemplary arrangements relate to a method for producing an implant, in particular an implant configured to be inserted into a Schlemm's canal of an eye, which includes the steps of providing an implant blank, which implant blank is comprised of material that is permeable to laser radiation. The method further includes subjecting at least one region of the implant blank to laser radiation. Subsequent to subjecting the least one region to radiation, the method further includes removing material from the at least one region via fluid etching.

GLASS WAFER WITH THROUGH GLASS VIAS

A wafer including a glass substrate is provided. The glass substrate includes a first surface defining a plane and including a surface roughness R.sub.a of approximately 0.3 nm in an outer via region and a second surface. The glass substrate defines a plurality of vias extending from the first surface. The plurality of vias each include an entrance defined by the first surface.

GLASS COMPOSITES HAVING A GRADIENT INDEX OF REFRACTION AND METHODS FOR PRODUCTION THEREOF

Gradient refractive index (GRIN) materials can include multi-phase composites having substances with differing refractive indices disposed non-uniformly within one another. Particular glass composites having a gradient index of refraction can include: an amorphous phase, and a phase-separated region disposed non-uniformly within the amorphous phase. The glass composites include a mixture containing: GeZ.sub.2 and A.sub.2Z.sub.3 in a combined molar ratio of about 60% to about 95%, and CsX and PbZ in a combined molar ratio of about 5% to about 40%, where A is As, Sb or Ga, X is Cl, Br or I, and Z is S or Se. When A is As, the glass composites include PbZ in a molar ratio of about 15% or less. The amorphous phase and the phase-separated region have refractive indices that differ from one another. More particularly, A is Ga or As, X is Cl, and Z is Se.

Anti-counterfeiting measures for glass articles

A glass container including a body having a delamination factor less than or equal to 10 and at least one marking is described. The body has an inner surface, an outer surface, and a wall thickness extending between the outer surface and the inner surface. The marking is located within the wall thickness. In particular, the marking is a portion of the body having a refractive index that differs from a refractive index of an unmarked portion of the body. Methods of forming the marking within the body are also described.

METHODS OF FORMING A SUBSTRATE HAVING AN OPEN PORE THEREIN AND PRODUCTS FORMED THEREBY

Methods and products formed thereby that include depositing a light-absorbing particle on a substrate and irradiating the particle with a pulsed laser beam to cause an increase in local temperature of a portion of the substrate contacted by and adjacent to the particle, enabling the particle to penetrate and migrate through the substrate to form a pore. The methods may include additional steps of applying a magnetic field gradient to the particle as the particle is irradiated with the laser beam in order to promote the movement of the particle within the substrate or to direct the movement of the particle within the substrate, and/or the step of filling the pore with a material that provides a functional capability independent of the properties of the substrate.