Exemplary cleaning or etching methods may include flowing a fluorine-containing precursor into a remote plasma region of a semiconductor processing chamber. Methods may include forming a plasma within the remote plasma region to generate plasma effluents of the fluorine-containing precursor. The methods may also include flowing the plasma effluents into a processing region of the semiconductor processing chamber. A substrate may be positioned within the processing region, and the substrate may include a region of exposed oxide. Methods may also include providing a hydrogen-containing precursor to the processing region. The methods may further include removing at least a portion of the exposed oxide while maintaining a relative humidity within the processing region below about 50%. Subsequent to the removal, the methods may include increasing the relative humidity within the processing region to greater than or about 50%. The methods may further include removing an additional amount of the exposed oxide.

A method includes forming a first insulating layer over a substrate, the first insulating layer having a non-planar top surface, the first insulating layer having a first etch rate. A second insulating layer is formed over the first insulating layer, the second insulating layer having a non-planar top surface, the second insulating layer having a second etch rate, the second etch rate being greater than the first etch rate. The second insulating layer is polished, the polishing partially removing the second insulating layer. The first insulating layer and the second insulating layer are non-selectively recessed.

The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate, especially a substrate comprising a silicon oxide layer, with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are wet-process ceria particles, have a median particle size of about 75 nm to about 200 nm, and are present in the polishing composition at a concentration of about 0.005 wt. % to about 2 wt. % a functionalized heterocycle, a cationic polymer selected from a quaternary amine, is cationic polyvinyl alcohol, and a cationic cellulose, optionally a carboxylic acid, a pH-adjusting agent, and an aqueous carrier, and have a pH of about 1 to about 6.

The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.

The present invention is an annealed quartz glass cloth that has an SiO.sub.2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.

The present invention is an annealed quartz glass cloth that has an SiO.sub.2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.

An optical fiber, manufacturing intermediate for forming an optical fiber and a method for forming an optical fiber. The method includes providing a manufacturing intermediate having an elongate body and having an aperture extending through the elongate body along an axial dimension of the elongate body, a boundary of the aperture defining an internal surface of the manufacturing intermediate. The method further includes etching the internal surface of the manufacturing intermediate using an etching substance, and drawing the manufacturing intermediate along the axial dimension so as to form the optical fiber.

An optical fiber, manufacturing intermediate for forming an optical fiber and a method for forming an optical fiber. The method includes providing a manufacturing intermediate having an elongate body and having an aperture extending through the elongate body along an axial dimension of the elongate body, a boundary of the aperture defining an internal surface of the manufacturing intermediate. The method further includes etching the internal surface of the manufacturing intermediate using an etching substance, and drawing the manufacturing intermediate along the axial dimension so as to form the optical fiber.

Microstructured multicore optical fibre with a microstructure area, in which, at least two basic cells are embedded, where each of them contains a core, preferably made of glass, specifically including doped silica glass or polymer, together with the surrounding it longitudinal areas with lower refraction index vs. that of the cladding, which areas may adopt the shape of holes, filled with gas, in particular with the air or a fluid or a polymer or spaces of another glass with doping allowing to reduce refractive index (further referred to as holes), embedded in a matrix of glass, in particular of silica glass or polymer. The refraction index of the holes is decreased vs. that of the matrix of glass, in particular of silica glass or polymer. The basic cell is characterised by the diameter of D2 core, the diameter of D3 core and the distance between adjacent holes, corresponding to lattice constant A. The centres of the holes are localised on the vertices and the middle points of the sides of the hexagon, the centre of which is designated by the core; the length of side c of the hexagon, created by the centres of holes, is equal to the preferably doubled lattice constant A. The juxtaposed, at least, two basic cells are surrounded by the cladding, preferably made of glass, in particular of silica glass or polymer. A Device for addressing cores of the multicore optical fibre a fabrication method of the device for addressing cores is also disclosed.

Microstructured multicore optical fibre with a microstructure area, in which, at least two basic cells are embedded, where each of them contains a core, preferably made of glass, specifically including doped silica glass or polymer, together with the surrounding it longitudinal areas with lower refraction index vs. that of the cladding, which areas may adopt the shape of holes, filled with gas, in particular with the air or a fluid or a polymer or spaces of another glass with doping allowing to reduce refractive index (further referred to as holes), embedded in a matrix of glass, in particular of silica glass or polymer. The refraction index of the holes is decreased vs. that of the matrix of glass, in particular of silica glass or polymer. The basic cell is characterised by the diameter of D2 core, the diameter of D3 core and the distance between adjacent holes, corresponding to lattice constant A. The centres of the holes are localised on the vertices and the middle points of the sides of the hexagon, the centre of which is designated by the core; the length of side c of the hexagon, created by the centres of holes, is equal to the preferably doubled lattice constant A. The juxtaposed, at least, two basic cells are surrounded by the cladding, preferably made of glass, in particular of silica glass or polymer. A Device for addressing cores of the multicore optical fibre a fabrication method of the device for addressing cores is also disclosed.