The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).

An LED tube lamp comprises a lamp tube, two end caps attached at two ends of the lamp tube respectively, a power supply disposed in one of the two end caps or separately in both of the end caps, an LED light strip disposed inside the lamp tube and a protective layer disposed on the LED light strip. The LED light strip comprises a mounting region and a connecting region. The plurality of LED light sources is mounted on the mounting region and two soldering pads are disposed on the connecting region. The mounting region and the connecting region are electrically connecting the plurality of LED light sources with the power supply. The protective layer comprises a plurality of first openings arranged on the mounting region for accommodating the LED light sources and two second openings are arranged on the connecting region for accommodating the two soldering pad.

A first substrate, having an evacuation port, and a second substrate are bonded together with a first sealing material in a frame shape interposed between them to create an internal space. The internal space is evacuated through the evacuation port, and the evacuation port is sealed up with the internal space kept evacuated. At this time, a second sealing material inserted into the evacuation port is heated and melted while being pressed toward the second substrate such that the evacuation port is sealed up with the second sealing material melted. The evacuation port and the second sealing material have dissimilar shapes when viewed along the center axis of the evacuation port in a state where the second sealing material has been inserted into the evacuation port but has not melted yet.

In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO.sub.x) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.

In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO.sub.x) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

An LED tube lamp comprises a lamp tube, two end caps attached at two ends of the lamp tube respectively, a power supply disposed in one of the two end caps or separately in both of the end caps, an LED light strip disposed inside the lamp tube and a protective layer disposed on the LED light strip. The LED light strip comprises a mounting region and a connecting region. The plurality of LED light sources is mounted on the mounting region and two soldering pads are disposed on the connecting region. The mounting region and the connecting region are electrically connecting the plurality of LED light sources with the power supply. The protective layer comprises a plurality of first openings arranged on the mounting region for accommodating the LED light sources and two second openings are arranged on the connecting region for accommodating the two soldering pad.

In a method for producing a bonded body, a bonding step includes a supporting step of mounting a laminate on a support device, and a pressing step of pressing the laminate. The support device includes a pressing member configured to press the laminate, a base member supporting the pressing member, a supporting member configured to support the laminate, and a fixing mechanism configured to fix the supporting member to the base member. In the supporting step, the fixing mechanism fixes the supporting member to the base member.

To provide laminated glass for a vehicle, which is excellent in heat-shielding properties and which is capable of maintaining visible light transmittance to be high even when used for a long period of time. Laminated glass for a vehicle, which is laminated glass comprising a pair of glass plates and an intermediate film sandwiched between the pair of glass plates, wherein in a laminated glass specimen of 1 cm.sup.2 cut out from the laminated glass in the thickness direction, the content of CeO.sub.2 is at most 0.4 mg, and the content of total iron converted to Fe.sub.2O.sub.3 is at least 6.0 mg and at most 10.0 mg; and the intermediate film is made of a resin film containing tin-doped indium oxide fine particles having an average particle diameter of at most 0.1 ?m.

An LED tube lamp comprises a lamp tube, two end caps attached at two ends of the lamp tube respectively, a power supply disposed in one of the two end caps or separately in both of the end caps, an LED light strip disposed inside the lamp tube and a protective layer disposed on the LED light strip. The LED light strip comprises a mounting region and a connecting region. The plurality of LED light sources is mounted on the mounting region and two soldering pads are disposed on the connecting region. The mounting region and the connecting region are electrically connecting the plurality of LED light sources with the power supply. The protective layer comprises a plurality of first openings arranged on the mounting region for accommodating the LED light sources and two second openings are arranged on the connecting region for accommodating the two soldering pad.