Patent classifications
C03C27/10
Thermoformed cover glass for an electronic device
Glass articles and methods for producing glass articles for a portable electronic device are disclosed. Properties of the glass articles, such as cover members, are improved through chemical strengthening, thermoforming, or a combination thereof. The glass articles may include barrier layers to prevent diffusion of ions between glass layers of the glass article, internal compressive stress regions, or a combination thereof.
Interlayer for laminated glass, laminated glass, and glass structure
An interlayer film for laminated glass of the present invention comprises at least an absorption region in which a skin absorption energy rate (X1) of a laminated glass is 25% or less, provided that the laminated glass is produced using two clear glass plates having a solar transmittance of 87.3% based on JIS R 3106.
TRIPLE PANE VACUUM INSULATED GLASS UNIT
Method for the production of a vacuum insulated glazing unit with more than two panes and a vacuum insulated glazing unit with more than two panes. In one example a triple pane vacuum insulated glazing assembly is fused and the cavity is backfilled during cooling whereby the centre pane temperature may be lowered. This has the advantage of keeping the stresses below the failure boundaries and enabling faster production.
GLASS ELECTROCHEMICAL SENSOR WITH WAFER LEVEL STACKING AND THROUGH GLASS VIA (TGV) INTERCONNECTS
A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.
GLASS ELECTROCHEMICAL SENSOR WITH WAFER LEVEL STACKING AND THROUGH GLASS VIA (TGV) INTERCONNECTS
A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.
INSULATED GLASS UNIT MANUFACTURING STATION AND ASSEMBLY LINE WITH CONTROLLED HEATING OF SPACER
A heating station for use with, for example, a high speed parallel manufacturing line for manufacturing insulated glass units, the heating station including at least two opposing infrared heaters that linearly heat spacer material that includes integrated temperature sensitive adhesive. Each of multiple linear infrared heaters includes a respective associated temperature sensor. The infrared heater and temperature sensor are coupled to a spacer heating controller that controls intensity and/or duration of heating of the spacer material and adhesive to provide optimal wetting and adhesive qualities. Individual control of the at least two opposing linear infrared heaters compensates for variable environmental conditions affecting spacer material at different locations around and insulated glass unit.
INSULATED GLASS UNIT MANUFACTURING STATION AND ASSEMBLY LINE WITH CONTROLLED HEATING OF SPACER
A heating station for use with, for example, a high speed parallel manufacturing line for manufacturing insulated glass units, the heating station including at least two opposing infrared heaters that linearly heat spacer material that includes integrated temperature sensitive adhesive. Each of multiple linear infrared heaters includes a respective associated temperature sensor. The infrared heater and temperature sensor are coupled to a spacer heating controller that controls intensity and/or duration of heating of the spacer material and adhesive to provide optimal wetting and adhesive qualities. Individual control of the at least two opposing linear infrared heaters compensates for variable environmental conditions affecting spacer material at different locations around and insulated glass unit.
INSULATED GLASS UNIT WITH INFRARED REFLECTING PIGMENTATION IN THE MASK
The invention relates to a roof or skylight window comprising a frame and an insulated glazing unit, where the insulated glazing unit comprises a first glass pane (10) and a second glass pane (20) each having inner surfaces (11, 21) opposing each other, and a side seal (4) arranged between the first glass pane (10) and the second glass pane (20) creating a sealed cavity (40) between the glass panes (10, 20). The first glass pane (10) comprises an edge surface region (14) overlapping the side seal (4) along at least a first part of the side seal (4), wherein the edge surface region (14) comprises an enamel layer (16) comprising pigments reflecting near infrared light.
INSULATED GLASS UNIT WITH INFRARED REFLECTING PIGMENTATION IN THE MASK
The invention relates to a roof or skylight window comprising a frame and an insulated glazing unit, where the insulated glazing unit comprises a first glass pane (10) and a second glass pane (20) each having inner surfaces (11, 21) opposing each other, and a side seal (4) arranged between the first glass pane (10) and the second glass pane (20) creating a sealed cavity (40) between the glass panes (10, 20). The first glass pane (10) comprises an edge surface region (14) overlapping the side seal (4) along at least a first part of the side seal (4), wherein the edge surface region (14) comprises an enamel layer (16) comprising pigments reflecting near infrared light.
ELECTRONIC DEVICE
An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.