An evacuated glazing assembly has first and second spaced-apart, non-metal substrates connected to each other by a seal element to form an evacuable interior space therebetween. The seal element is formed by bonding a metallic bridge element to at least one of the substrates by cold welding to form a first stage seal and forming a second stage seal at least partially in contact with the first stage seal. The seal element is configured to hermetically isolate the interior space from the surrounding environment, and both the first stage seal and the second stage seal contribute to the hermeticity of the seal element.

An evacuated glazing assembly has first and second spaced-apart, non-metal substrates connected to each other by a seal element to form an evacuable interior space therebetween. The seal element is formed by bonding a metallic bridge element to at least one of the substrates by cold welding to form a first stage seal and forming a second stage seal at least partially in contact with the first stage seal. The seal element is configured to hermetically isolate the interior space from the surrounding environment, and both the first stage seal and the second stage seal contribute to the hermeticity of the seal element.

An assembly includes a plurality of partitions to partition an internal space, surrounded with a pair of glass substrates arranged to face each other and a the peripheral wall having a frame shape and provided between the pair of glass substrates, into an evacuation space and a ventilation space. The plurality of partitions includes a first partition and a second partition, of which lengths are defined in two different directions. An end of the second partition faces a side portion of the first partition with a predetermined gap left between them. A space between the end of the second partition and the side portion of the first partition constitutes an air passage to evacuate the evacuation space through an evacuation port. The second partition includes, at the end thereof, a swollen portion protruding toward the evacuation space at least along the width of the second partition.

An electronic device may include electrical components and other components mounted within an interior of a housing. The device may have a display on a front face of the device and may have a glass layer that forms a housing wall on a rear face of the device. The glass housing wall may be provided with regions having different appearances. The regions may be textured, may have coatings such as thin-film interference filter coatings formed from stacks of dielectric material having alternating indices of refraction, may have metal coating layers, and/or may have ink coating layers. Textured surfaces, cavities, coatings, and other decoration may be embedded in glass structures that are joined with chemical bonds at diffusion-bonding interfaces.

An electronic device may include electrical components and other components mounted within an interior of a housing. The device may have a display on a front face of the device and may have a glass layer that forms a housing wall on a rear face of the device. The glass housing wall may be provided with regions having different appearances. The regions may be textured, may have coatings such as thin-film interference filter coatings formed from stacks of dielectric material having alternating indices of refraction, may have metal coating layers, and/or may have ink coating layers. Textured surfaces, cavities, coatings, and other decoration may be embedded in glass structures that are joined with chemical bonds at diffusion-bonding interfaces.

A screen protector application kit includes a glass-based substrate (110) having an adhesive belt (270) and an adhesive container (478) of an uncured adhesive composition. The adhesive belt (270) includes a first major surface (272) adhered to the glass-based substrate (110), a second major surface (274), a distal edge (276) extending between the first major surface (272) and the second major surface (274), and a proximal edge (278) extending between the first major surface (272) and the second major surface (274). The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor.

A cooking apparatus including a main body provided to accommodate an induction heating coil, and a glass assembly provided above the main body to allow a cooking container to be placed thereon. The glass assembly includes a first glass forming a first area on which the cooking container is to be placed, a second glass forming a second area separated from the first area, and a coupling member coupleable to each of the first glass and the second glass, the coupling member including a base disposed below the first glass and the second glass to support the first glass and the second glass while the first glass and the second glass are coupled to the coupling member, and a column formed to extend upward from the base and curved to correspond to a side surface of the first glass and a side surface of the second glass.

A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.

An optical coating for a glass substrate includes an inner metal or metal alloy layer, a first pair of transparent conductive oxide or dielectric layers, and a pair of outer metal or metal alloy layers. The optical coating includes an eye-weighted transmittance of less than about 20% and an eye-weighted reflectance of less than about 30%, as measured with a D65 illuminant according to the CIE 10° Standard Observer.