The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A sound absorbing panel and method therefor comprising providing a first sheet of photosensitive material, applying a first mask having a first plurality of features to the first sheet of photosensitive material, exposing the masked material to ultraviolet light, heating the first sheet of photosensitive material to form crystals in exposed portions of the first sheet, and etching the crystals to form a second plurality of features in the first sheet of photosensitive material.

To provide a substrate with a film excellent in fingerprint stain removability and sliding resistance.

The substrate with a film of the present invention comprises a substrate and a film having a poly(oxyfluoroalkylene) chain disposed only on a part of region on the principal plane of the substrate.

The specification discloses a method for containing spills on shelving and the like, and the resulting support members made in accordance with the method, by providing the generally flat top surface of a support with a hydrophobic surface which is arranged in a spill containment pattern and which is generally in the plane of the top surface of the support. The majority of the top surface of the support consists of one or more spill containment areas which are of a non-hydrophobic nature and which are bounded by the hydrophobic surfaces, such that spills on the shelving collect in the non-hydrophobic spill containment area or areas and are prevented from spreading by the hydrophobic surfaces.

A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.

Introduced is an electronic device comprising: a window having a curved surface at an edge portion thereof; a housing on which the window is seated; and a reinforcing coating layer surrounding at least a portion of the surface of the window, wherein the window comprises: a first surface on which contact is made with a user; a second surface opposite to the first surface; and a third surface for connecting the first surface and the second surface, wherein the housing is configured to cover the third surface of the window, and the reinforcing coating layer is configured to surround at least the third surface of the window. Various other embodiments are possible.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

A cover glass and a manufacturing method thereof are provided, the method includes: coating a first organic layer on a transparent substrate; forming first via holes on the first organic layer at intervals, heating and melting the first organic layer to flow; wet-etching the transparent substrate having the first organic layer to form a first microstructure on a region of the transparent substrate not shielded by the first organic layer; and removing the first organic layer form the transparent substrate. The present disclosure breaks the limitation for preparing microstructures with size below 5 m in the existing photolithography process, the organic material in wet-etching process can be controlled by heating to make the organic material melted to flow. The size of the microstructure can be reduced and flexibly adjusted according to the pixel size of display panel, the speckle effect of the display device caused by anti-glare treatment can be reduced.