The present invention provides, in at least one embodiment, a film and method for engraving objects. The film includes an adhesive layer configured to allow the film to be easily repositionable on the surface of an object. For example, the film can be shifted, rotated, or moved prior to pressure being applied and before the engraving. Additionally, the photoresist layer includes microspheres comprising small pockets of air which strengthen the photoresist layer by bouncing the engraving blast away and allow the photoresist layer to advantageously be designed thinner.

The present invention relates to xylanase variants. The present invention also relates to polynucleotides encoding the variants; nucleic acid constructs, vectors, and host cells comprising the polynucleotides; and methods of using the variants.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

A patterning method according to one embodiment includes forming a ground layer on a processing target layer. The ground layer has higher affinity for one of a first segment and a second segment contained in a self-assembly material than for the other segment. The neutral layer is patterned on the ground layer. The neutral layer is neutral to the first segment and the second segment. Exposing surfaces of the ground layer and the neutral layer is irradiated with an energy ray. The self-assembly material is applied onto the ground layer and the neutral layer. The self-assembly material is phase-separated into a first domain including the first segment and a second domain including the second segment. One of the first domain and the second domain is selectively removed.

A method of etching a display panel for manufacturing a curved display device comprises the steps of: applying a masking ink in a manner of immersing a non-etched portion of a display panel into an ink reservoir, which contains the masking ink, in order to protrude the non-etched portion from the display panel; curing the masking ink coated on the non-etched portion of the display panel; etching the display panel to reduce the thickness of the display panel by coating an etching liquid onto the display panel on which the masking ink is cured; and removing the masking ink from the etched display panel with a solvent, which dissolves the masking ink.

Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A method of manufacturing an etched glass article including the steps of jetting an image with a UV curable inkjet ink on a surface of the glass article; curing the image; etching the surface not covered by the UV cured image to obtain an etched image; and solubilising the UV cured image in an aqueous alkaline solution.

An object of the present invention is to provide a chemically strengthened glass having enhanced surface strength and bending strength. The present invention relates to a chemically strengthened glass having a compressive stress layer formed on a surface layer thereof by an ion exchange method, in which a straight line obtained by a linear approximation of a hydrogen concentration Y in a region of a depth X from an outermost surface of the glass satisfies a specific relational equation (I) in X=0.1 to 0.4 (μm), and an edge surface connecting main surfaces on a front side and a back side of the glass has a skewness (Rsk) measured based on JIS B0601 (2001) being −1.3 or more.

The present invention, relates, to a process, for producing structured coatings, in which a coating composition comprising at least one inorganic binder, at least one oxide pigment which, after addition of a mixture consisting of 15 ml of 1 M oxalic acid and 15 ml of 20% aqueous hydrochloric acid based on 1 g of substance, under standard conditions, leads to a temperature rise of at least 4° C., and at least one solvent is applied to a substrate, the resulting coating composition film is partially coated with a photoresist and the substrate coated with the coating composition and the photoresist is treated with an acid, to the structured layers obtainable by the process and to the use thereof.