A substrate for a display article includes: a primary surface; a textured region on at least a portion of the primary surface, the textured region comprising surface features that reflect a random distribution, each of the surface features comprising a perimeter that is parallel to a base-plane extending through a thickness of the substrate below the textured region, wherein the perimeter is elliptical. The textured region can further include (i) one or more higher surfaces residing at a higher mean elevation from the base-plane and (ii) one or more lower surfaces residing at a lower mean elevation from the base-plane that is closer to the base-plane than the higher mean elevation. The higher mean elevation can differ from the lower mean elevation by a distance within a range of 0.05 μm to 0.70 μm.

Methods of processing coated articles, such as transparencies, are provided comprising flash annealing one or more layers of the coated article. The one or more layers may be reflective metallic layers, such as silver layers, or comprise a transparent conductive oxide, such as indium tin oxide, or a semiconductor.

A method for structuring a decorative or technical pattern in the thickness of an object made of an at least partially transparent amorphous, semi-crystalline or crystalline material, wherein the object is made of an at least partially transparent material including a top surface and a bottom surface which extends away from the top surface. The top or bottom surfaces is provided with a mask defining an opening whose outline corresponds to the profile of the pattern to be structured, the mask covering the top or bottom surface at the positions which are not to be structured. The pattern is structured with a mono- or multicharged ion beam through the opening of the mask, wherein the mechanical properties of the mask are sufficient to prevent the ions of the ion beam from etching the top or bottom surface at the positions where this top or bottom surface is covered by the mask.

A method of making a strengthened article that includes: providing an article comprising a glass, glass-ceramic or ceramic composition with a plurality of ion-exchangeable alkali metal ions, a first primary surface and a second primary surface; forming a SiO.sub.2-containing film over the first primary surface, wherein the SiO.sub.2-containing film comprises a thickness from about 5 nanometers to about 20 nanometers; forming an anti-glare surface integral with the second primary surface; providing a first ion-exchange bath comprising a plurality of ion-exchanging alkali metal ions, each having a larger size than the size of the ion-exchangeable alkali metal ions; and submersing the article in the first ion-exchange bath at a first ion-exchange temperature and duration to form a strengthened article. Further, the strengthened article comprises a compressive stress region extending from the first primary surface and the second primary surface to first and second selected depths, respectively.

A method for manufacturing a color slide for an automobile projection lamp includes: forming a plurality of same color pattern units on a glass substrate, each of the color pattern units being composed of a plurality of color coating layers. The plurality of color coating layers are formed by sequentially depositing materials having different colors on a surface of the glass substrate in accordance with different colors. Finally, the glass substrate is cut and separated in unit of one color pattern unit to form an independent color slide with the color pattern. The color slide can be mounted to an automobile projection lamp system for projecting the color pattern.

A process for obtaining a material including a glass sheet, includes providing a glass sheet including a first face coated at least partly by an essentially mineral first coating, the face having at least one first zone and at least one second zone, the at least one first zone having a higher emissivity than that of the second zone, then applying, on at least one portion of the second zone, a sacrificial layer including a resin, then heat treating the coated glass sheet at a temperature of at least 550° C., during which step the sacrificial layer is removed by combustion.

The specification discloses a method for containing spills on shelving and the like, and the resulting support members made in accordance with the method, by providing the generally flat top surface of a support with a hydrophobic surface which is arranged in a spill containment pattern and which is generally in the plane of the top surface of the support. The majority of the top surface of the support consists of one or more spill containment areas which are of a non-hydrophobic nature and which are bounded by the hydrophobic surfaces, such that spills on the shelving collect in the non-hydrophobic spill containment area or areas and are prevented from spreading by the hydrophobic surfaces.

Plasma etching processes for forming patterns in high refractive index glass substrates, such as for use as waveguides, are provided herein. The substrates may be formed of glass having a refractive index of greater than or equal to about 1.65 and having less than about 50 wt % SiO.sub.2. The plasma etching processes may include both chemical and physical etching components. In some embodiments, the plasma etching processes can include forming a patterned mask layer on at least a portion of the high refractive index glass substrate and exposing the mask layer and high refractive index glass substrate to a plasma to remove high refractive index glass from the exposed portions of the substrate. Any remaining mask layer is subsequently removed from the high refractive index glass substrate. The removal of the glass forms a desired patterned structure, such as a diffractive grating, in the high refractive index glass substrate.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.