A camera module according to one embodiment comprises: a barrel provided with at least one lens; a retainer having an inner space and accommodating the barrel in the inner space; a holder coupled to the lower portion of the retainer; a housing disposed on the lower side of the holder and accommodating a printed circuit board; and a cover part mounted on the retainer and disposed in front of the lens. The cover part comprises: a cover glass; a first reflection suppression layer disposed on the upper side of the cover glass; a heating layer disposed on the lower side of the glass cover; and a second reflection suppression layer disposed on the lower side of the heating layer.

The present disclosure provides a flexible organic light emitting diode (OLED) display panel and a method for fabricating the same. The flexible OLED display panel includes a first flexible transparent substrate, a buffer layer covering the first flexible transparent substrate, and a second flexible transparent substrate covering the buffer layer. A surface of the first flexible transparent substrate in contact with the buffer layer is formed with a first rough structure. A surface of the buffer layer in contact with the second flexible transparent substrate is formed with a second rough structure.

A sub-assembly includes a glass substrate, a plurality of electronic devices, and a passivation layer. The glass substrate includes a first surface, a second surface opposite to the first surface, and a third surface extending between the first surface and the second surface. The glass substrate includes a plurality of laser damaged regions extending from the first surface to the second surface. The plurality of electronic devices are on the first surface of the glass substrate. The passivation layer is on the plurality of electronic devices and the third surface of the glass substrate. The passivation layer includes an opening to each laser damaged region of the plurality of laser damaged regions.

A component carrier includes a glass core having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the glass core; a first electrically conductive layer structure applied on the first electrically insulating layer structure; and at least one inner hole extending through the glass core and the first electrically insulating layer structure.

Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

Aspects of the present disclosure relate generally to methods and apparatus of processing transparent substrates, such as glass substrates. In one implementation, a film stack for optical devices includes a glass substrate including a first surface and a second surface. The film stack includes a device function layer formed on the first surface, a hard mask layer formed on the device function layer, and a substrate recognition layer formed on the hard mask layer. The hard mask layer includes one or more of chromium, ruthenium, or titanium nitride. The film stack includes a backside layer formed on the second surface. The backside layer formed on the second surface includes one or more of a conductive layer or an oxide layer.

This disclosure relates to an antireflection film, as well as its use on a substrate (3) to decrease a fracture of light striking the substrate (3) reflected by said substrate (3), wherein said coating is formed of a transparent first layer (1) applied on the substrate (3) and a transparent second layer (2) on said first layer (1). The essence of the solutions according to this disclosure is that thickness (d.sub.1) of the first layer (1) ranges from 10 to 70 nm and refractive index (n.sub.1) of said first layer (1) satisfies the relation 1.05<n.sub.1<1.35 within the wavelength range of 375 to 1000 nm, and wherein thickness (d.sub.2) of the second layer (2) ranges from 30 to 100 nm and refractive index (n.sub.2) of said second layer (2) satisfies the relation 1.25<n.sub.2<1.5 within the wavelength range of 375 to 1000 nm, and wherein n.sub.1<n.sub.2 also holds.

A heating device equipped with a chamber defining a cavity, includes a door or wall incorporating a triple glazing including three transparent substrates defining, from the interior to the exterior of the cavity, faces numbered 1 to 6 respectively, at least the faces 1 and 2 of the first substrate and 3 and/or 4 of the second substrate being covered with heat-reflecting coatings, wherein the mean spacing e1 between the first substrate and the second substrate and the mean spacing e2 between the second substrate and the third substrate is different, the ratio between the largest spacing and the smallest spacing being greater than 1.1, and e1 and e2 being between 2 and 20 mm.

A camera module according to one embodiment comprises: a barrel provided with at least one lens; a retainer having an inner space and accommodating the barrel in the inner space; a holder coupled to the lower portion of the retainer; a housing disposed on the lower side of the holder and accommodating a printed circuit board; and a cover part mounted on the retainer and disposed in front of the lens. The cover part comprises: a cover glass; a first reflection suppression layer disposed on the upper side of the cover glass; a heating layer disposed on the lower side of the glass cover; and a second reflection suppression layer disposed on the lower side of the heating layer.

The present disclosure provides a flexible organic light emitting diode (OLED) display panel and a method for fabricating the same. The flexible OLED display panel includes a first flexible transparent substrate, a buffer layer covering the first flexible transparent substrate, and a second flexible transparent substrate covering the buffer layer. A surface of the first flexible transparent substrate in contact with the buffer layer is formed with a first rough structure. A surface of the buffer layer in contact with the second flexible transparent substrate is formed with a second rough structure.