A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

An asphalt-cement concrete (“ACC”) interlayer formed of a plant-mix material reinforced with aramid fibers, deposited at a thickness of at least one inch (1″) over a Portland-cement concrete (“PCC”) or ACC base, can extend the service life of a hot-mix asphalt (“HMA”) surface layer installed over the interlayer by retarding or preventing “reflected” cracks—cracks in the surface layer that correspond to cracks, damage and irregularities in the PCC or ACC base. When the surface layer's useable life has expired, it can be removed and replaced, and the interlayer can continue to protect the new surface layer.

Ceiling tiles and wallboards can be produced with vesicle dedusting agent. For example, a ceiling tile can comprise: a dried base mat that includes: (a) mineral wool; (b) binder; (c) a vesicle dedusting agent at about 0.01 to about 10 wt %, wherein the vesicle dedusting agent comprises vesicles; (d) optionally cellulosic fiber; (e) optionally perlite; (f) optionally glass fiber; and (g) optionally calcium sulfate dihydrate. For example, a wallboard produced from a slurry comprising: (a) calcium sulfate hemihydrate at 70 to 95 wt %; (b) a vesicle dedusting agent at about 0.01 to about 10 wt %, wherein the vesicle dedusting agent comprises vesicles; (c) optionally cellulose fibers at about 0.5 to about 3 wt %; (d) optionally at least one dispersant at about 0.01 to about 2 wt %; and (e) water at a ratio of water to dry components of about 1:6 to about 20:1.

A method of treating a subterranean formation penetrated by a wellbore, comprising introducing a chemical packer composition into the wellbore, wherein the chemical packer composition comprises water, a suspending agent, a gelling agent, and a sealant composition and wherein the chemical packer composition has a pH greater than 9, and allowing the chemical packer composition to form a plug, wherein a portion of the wellbore below the plug is isolated from fluid communication with a portion of the wellbore above the plug.

A method of treating a subterranean formation penetrated by a wellbore, comprising introducing a chemical packer composition into the wellbore, wherein the chemical packer composition comprises water, a suspending agent, a gelling agent, and a sealant composition and wherein the chemical packer composition has a pH greater than 9, and allowing the chemical packer composition to form a plug, wherein a portion of the wellbore below the plug is isolated from fluid communication with a portion of the wellbore above the plug.

The disclosure features methods of forming composite materials, and the composite materials formed by such methods. The methods include forming a mixture that includes a binder material and a filler material, and applying a pressure of at least 10 MPa to the mixture to form the composite material, where the composite material thus formed includes less than 9% by weight of the binder material, less than 18% by volume of the binder material, or both, and has a flexural strength of at least 3 MPa.

A premixed photoluminescent composition and related hardened form and method of forming joints for pavers or stones. The premixed photoluminescent composition comprises solid aggregates; a photoluminescent particulate component adapted to emit light when photoexcited; and a binder. When in contact with an activator, oxygen or water, the binder is adapted to harden into a water-resistant binder matrix that bonds the solid aggregates and embeds the photoluminescent particulate component. In use, the water-resistant binder matrix has a transparency allowing transmission of at least a portion of the light emitted by the photoluminescent particulate component.

A performance-enhancing cement admixture composition is disclosed. The composition comprises water and a concentrated biopolymer composition derived from wheat straw, alfalfa, or other cereal grain straws. The concentrated biopolymer composition may include inorganic material and a copolymer comprised of lignin and polysaccharides.