Patent classifications
C04B35/505
HIGH STRENGTH CERAMICS WITH NOVEL FRACTURE MODE
The present invention provides a method for making a high strength, small grain size ceramic having a trans-granular fracture mode by rapid densification of a green body and subsequent cooling of the densified ceramic. The ceramic may include dislocations, defects, dopants, and/or secondary phases that are formed as a result of the process and resulting in stress fields capable of redirecting or arresting cracks within the material. This ceramic can maintain transparency from ultraviolet to mid-wave infrared.
HIGH STRENGTH CERAMICS WITH NOVEL FRACTURE MODE
The present invention provides a method for making a high strength, small grain size ceramic having a trans-granular fracture mode by rapid densification of a green body and subsequent cooling of the densified ceramic. The ceramic may include dislocations, defects, dopants, and/or secondary phases that are formed as a result of the process and resulting in stress fields capable of redirecting or arresting cracks within the material. This ceramic can maintain transparency from ultraviolet to mid-wave infrared.
Pressure forming of metal and ceramic powders
A method of pressure forming a brown part from metal and/or ceramic particle feedstocks includes: introducing into a mold cavity or extruder a first feedstock and one or more additional feedstocks or a green or brown state insert made from a feedstock, wherein the different feedstocks correspond to the different portions of the part; pressurizing the mold cavity or extruder to produce a preform having a plurality of portions corresponding to the first and one or more additional feedstocks, and debinding the preform. Micro voids and interstitial paths from the interior of the preform part to the exterior allow the escape of decomposing or subliming backbone component substantially without creating macro voids due to internal pressure. The large brown preform may then be sintered and subsequently thermomechanically processed to produce a net wrought microstructure and properties that are substantially free the interstitial spaces.
Pressure forming of metal and ceramic powders
A method of pressure forming a brown part from metal and/or ceramic particle feedstocks includes: introducing into a mold cavity or extruder a first feedstock and one or more additional feedstocks or a green or brown state insert made from a feedstock, wherein the different feedstocks correspond to the different portions of the part; pressurizing the mold cavity or extruder to produce a preform having a plurality of portions corresponding to the first and one or more additional feedstocks, and debinding the preform. Micro voids and interstitial paths from the interior of the preform part to the exterior allow the escape of decomposing or subliming backbone component substantially without creating macro voids due to internal pressure. The large brown preform may then be sintered and subsequently thermomechanically processed to produce a net wrought microstructure and properties that are substantially free the interstitial spaces.
Gas nozzle and plasma device employing same
A gas nozzle according to an embodiment of the present invention includes a columnar main body including a ceramic sintered body having a through hole through which gas flows. An outlet of the through hole for the gas is formed on one end face of the main body. An inner wall of the through hole has a first region located in a vicinity of the outlet, and a second region located further inward of the main body than the first region. The first region and the second region each include a sintered surface of the ceramic sintered body. Average crystal grain size in the first region is larger than average crystal grain size in the second region.
Emissivity controlled coatings for semiconductor chamber components
A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.
Emissivity controlled coatings for semiconductor chamber components
A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.
Methods of making nanopowders, nanoceramic materials and nanoceramic components
Methods of forming nanoceramic materials and components. The methods may include performing atomic layer deposition to form a plurality of nanoparticles, including forming a thin film coating over core particles, or sintering the nanoparticles in a mold. The nanoparticles can include a first material selected from a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride or combinations thereof.
Methods of making nanopowders, nanoceramic materials and nanoceramic components
Methods of forming nanoceramic materials and components. The methods may include performing atomic layer deposition to form a plurality of nanoparticles, including forming a thin film coating over core particles, or sintering the nanoparticles in a mold. The nanoparticles can include a first material selected from a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride or combinations thereof.
Ceramic substrate with glass fill for decoration and housing materials
A ceramic composite article includes a substrate including a matrix of ceramic material defining a network of interstitial regions and a transparent material occupying at least some of the interstitial regions of the substrate. The transparent material can have a melting point lower than a melting point of the ceramic material. The matrix of ceramic material can be formed by a 3D printing process.